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Ansys 2024 R1: High Frequency Electronics What’s New

Learn about the latest improvements and new features to the high frequency electronics simulation tools. There are many enhancements for engineers involved in RF, automotive, A&D, and consumer electronics designs that our subject matter experts will discuss. 


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This Ansys 2024 R1 webinar will review the high-frequency electronics tool updates, enhancements, and new features – HFSS, Q3D, SIwave, and NuHertz. Engineers developing PCBs, antennas, and other RF capabilities for telecommunications, HPC, automotive, A&D, and IoT applications will find many new capabilities and improvements in this update.

What you will learn

  • Encrypted technology file support in HFSS 3D Layout IC Mode
  • Enhanced support for FlexPCB in HFSS 3D
  • HFSS Finite Array metadata export and mask automation
  • Icepak Thermal Mesh Fusion
  • Solver enhancements for SIwave and Q3D
  • Improvements to HPC/Distributed Computing support for all products

Who should attend and why

Engineers involved in new product development for any electronics market


  • Juliano Mologni

Juliano Mologni is a Lead Product Manager in the Electronics Business Unit at Ansys, responsible for all HF electronics products. He has over 20 years of experience in computational electromagnetics and is the author of multiple patents and more than 60 journal and conference papers. Juliano is involved in many RF and EMC projects with top automotive, A&D, appliances, and high tech companies. He holds a BSc degree in telecommunication engineering and an MSc in microelectronics and has authored a PhD thesis on automotive EMC and signal integrity.