Discover how Ansys Discovery and Icepak enhance your electronics thermal design, merging quick concept validation with high-fidelity analysis in a streamlined workflow for design engineers.
DATE/TIME:
June 3 , 2025
11 AM IST
Venue:
Virtual
In today’s fast-paced development cycles, design and simulation engineers need tools that balance speed with accuracy. This webinar compares Ansys Discovery and Ansys Icepak, two robust solutions for electronics thermal simulation.
Learn how Discovery empowers design engineers to quickly explore thermal concepts with real-time, interactive feedback — ideal for early-stage iteration. Then see how simulation engineers can transition to Ansys Icepak for high-fidelity, CFD-driven analysis of detailed electronics systems, including PCBs, ICs, and enclosures.
We’ll walk through side-by-side workflows to highlight how both tools complement each other across the product development process, enabling faster decisions, better collaboration, and improved thermal performance. Whether designing next-gen electronics or validating mission-critical systems, this session will help you streamline your thermal design strategy from concept to sign-off.
All engineers, specialists, and engineers who are focused on system-level electronics cooling workflows
