Ansys 2023 R1: Ansys Icepak with AEDT What’s New

The 2023 R1 update to Ansys Icepak contains multiple improvements, such as faster simulations, more robust PCB meshing, and an enhanced Compact Thermal Model for supporting Redhawk-SC Electrothermal.

Venue:
Virtual

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About this Webinar

The 2023 R1 release for Ansys Icepak offers a large set of enhancements – meshing improvements, faster simulations, and an upgrade to the Compact Thermal Model for use with Redhawk-SC Electrothermal and encrypted TSMC technology.

What You Will Learn

New Meshing Enhancements include stair step meshing (2D multilevel), capturing individual layers and details, resulting in a more robust PCB meshing that functions on stacked and layered structures
Enhanced post-processing for thermal fields resulting in a 2-3X speedup in performance over the 22R2 version
Compact Thermal Model (CTM) Version 2 supports code simulation bidirectionally with Redhawk-SC ET when utilizing encrypted TSMC technology
Capture environmental effects (fans/airflow and convection/radiation) and then return this thermal data to RHSC-ET

Who Should Attend

Icepak users

Speaker

Jeffrey Tharp

Jeffrey Tharp is a 15 year veteran of Ansys. With a range of experience from ACE to Product Management, Jeffrey is currently Senior Product Manager for Ansys Thermal Solutions.