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Brochures

Electromagnetics Solutions

Robust, industry-leading solutions from ANSYS simulate electromagnetic fields and compute electrical parameters that govern electronic device behavior — enabling you to optimize your product’s performance. Spanning the full spectrum of electromagnetic analysis and design, ANSYS tools enable companies to leverage best-in-class technology to confidently predict device behavior, dramatically reduce prototype and physical testing costs, and launch innovative, competitive products faster.

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Brochures

Fluid Dynamics Solutions

Engineering simulation software — which enables product design and analysis in a virtual environment — has revolutionized fluid dynamics by automating the solution, even for problems that are numerically large. ANSYS brings together two of the most respected names in fluid dynamics simulation — Fluent and CFX — to expertly address your CFD needs with industry-leading technology depth and breadth. Backed by reliable technology that has been verified by academic and independent researchers, technology partners, and a multitude of customers both large and small, our solutions are the tools of choice for innovative product development organizations around the world, in virtually every industry.

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Webinars

Streamline Mixing Analysis and Enable Quality by Design Using ANSYS Workbench

Computational fluid dynamics (CFD) tools are already widely utilized to gain insight into the hydrodynamic and mass transfer environment in mixing tanks and other unit operations. The current situation is such that simulations tend to focus on a single design point and/or a small range of process parameters. The primary goal of this webinar is to show how single-point simulation studies can be readily extended to explore the engineering design space of a process by coupling CFD to statistical tools.

Run Time - 1 hour

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Video

Chip-Package-System Convergence

Chip-Package-System (CPS) is the best methodology to reliably achieve the performance, integration, and cost demands of today's electronics, allowing chip, package, and system engineers to communicate with each other, creating a cohesive design eco-system.

Run Time - 2:20

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Video

ANSYS SpaceClaim Direct Modeling

SpaceClaim Direct Modeling - geometry creation and CAD model clean-up made faster/better/easier with direct modeling.

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White Papers

The Race to 6G — Faster Networks and Devices Promise a World of New Possibilities

The impact of electronics is being felt in every industry. One key enabler is the continuing evolution of the integrated circuit (IC) toward higher speeds and lower power consumption, providing the ability to make products of all kinds smaller and more powerful. Increasing frequencies and shrinking geometries create a range of new challenges for engineers and designers: signal integrity, electromagnetic interference, thermal performance and mechanical integrity ―problems that cross physics disciplines and must be studied at both component and system levels. Multiphysics simulation is usually thought of as an engineering tool, but it has business implications as well, especially applicable to today’s highly competitive marketplace.

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Webinars

Ask the Expert – Modeling Threaded Connections using ANSYS Mechanical

The need to perform FE simulations of threads can be tied up with different engineering objectives:
1. Thread form design/selection
2. Evaluating tightening torque for a proposed design of threads
3. Stress analysis under different loading conditions
4. Study the changes in thread characteristics upon repeated tightening - loosening.

Successful thread simulations require to be computationally inexpensive so that the engineers can perform adequate number of design iterations. However, the thread simulation convergence and results are known to be sensitive to contact settings and may require some extra computational time to resolve the contacts well.

Run Time - 1 hour

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Webinars

Ask the Expert - Modeling Airborne Noise using ANSYS CFD

The problem of airborne noise generation, propagation and mitigation is of importance in many engineering applications across different industries including aerospace, automotive, electronics, power, HVAC. This webinar focuses on simulation approaches to aeroacoustic problems in ANSYS CFD. They include a direct Computational Aeroacoustics (CAA) methodology, far-field noise propagation using the Ffowcs Williams and Hawkings acoustics analogy, and broadband noise models. Special attention is paid to obtaining an accurate transient solution of an unsteady turbulent flow which is essential to high-fidelity acoustic predictions. Recommendations on appropriate solver settings, discretization schemes, initial and boundary conditions, and post-processing of acoustic data is provided.

Run Time - 1 hour

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Webinars

Ask the Expert - Different Methodologies of Modeling IC Packages in ANSYS Icepak

Avoiding high temperatures in IC packages and ensuring reliability of the associated system is key to a successful package design. Increasing complexity and power dissipation of electronic designs, along with the reduction of the chip sizes and increased power densities makes thermal analysis even more critical. Thermal analysis of IC packages predict the temperature distribution within the IC package and play a critical role in the IC package design.

Thermal analysis of IC packages can be done with different modeling aims, e.g.,, package viability/selection, package to PCB heat spreading, heat sink design, board layout, system flow and thermal design, etc. ANSYS Icepak offers a variety of methods to model IC packages depending on the final aim of the thermal analysis. These methods ranges from detailed thermal models for characterization or customization of the packages to use of compact conduction models, DELPHI network models, low conductivity blocks, resistance network models, etc.

This presentation will help ANSYS Icepak users capitalize on the different techniques available for modeling IC packages in thermal simulations. Applicability of each modeling method pertaining to different modeling goals will be discussed.

Run Time - 1 hour

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Webinars

Ask the Expert - Gas-solid Flow Modeling with ANSYS CFD

Engineering simulations of fluidized beds concern phenomenon spanning a wide range of length scales. Length scales range from the size of a particle, through the size of spargers, baffles and finally to scale of the equipment. Besides flow, additional processes such as heat transfer, heterogeneous and homogeneous reactions are important in several scenarios. In this webinar we will review various models for gas solid flows in ANSYS CFD 13.0. We will demonstrate how models in ANSYS CFD can be used efficiently to address engineering problems in fluidized beds and other gas-solid flow problem. Using the recently concluded “NETL Fluidization modeling challenge problem” as one of the examples, we will examine the various models available in ANSYS CFD and how they can be applied to address key engineering questions.

Run Time - 1 hour

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