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Webinar

Ansys Optics Deep Dive: Fiber-to-Chip Coupling Solutions for Co-Packaged Optics

This webinar explores cutting-edge advancements in photonics design, with a focus on miniaturization and co-packaged optics. Discover the latest Ansys Lumerical product feature updates tailored for co-packaged optics, followed by a live demonstration showcasing fiber-to-photonic chip coupling with microlenses and edge couplers—essential for addressing the challenges of precise alignment, coupling efficiency, and cost-effective design in integrated circuits. A customer presentation will provide real-world insights, along with a live Q&A session to address your questions.

This event is your gateway to unlocking new levels of performance, reliability, and innovation in photonic design.

What Attendees Will Learn:

  • Enhance your CPO design skills to achieve better system design and analysis outcomes
  • Learn about streamlined workflows that apply advanced features and best practices
  • Connect with industry peers and exchange valuable insights
  • Stay up to date on Ansys Lumerical software updates

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    If you're facing engineering challenges, our team is here to assist. With a wealth of experience and a commitment to innovation, we invite you to reach out to us. Let's collaborate to turn your engineering obstacles into opportunities for growth and success. Contact us today to start the conversation.