DAC 2016

Big Data for EDA

The First Big Data and Machine Learning System for Engineering Simulation

Visit booth 1449 to learn how ANSYS SeaScape and SeaHawk can transform your product development process.

Attend our In-Design Industry Workshops or Best Practices Seminars to discover how ANSYS is reinventing power noise and reliability sign-off using elastic compute platforms, while helping RTL-to-GDS chip and electronic system designers achieve a faster chip-package-system convergence.

Visit us also at another place - ARM Connected Community  -  Booth 1748,   Samsung Booth 607,   TSMC Booth 1933


Industry Workshops

In each of the four workshops, leading semiconductor companies will discuss latest industry trends and share their best practices on power, noise and reliability simulations for their ICs. At each workshop, three industry experts will share how they used ANSYS simulation platforms to simulate and optimize their designs. The audience for these workshops are “by invitation-only.”

Workshop 1 - Industry Trends on Low Power RTL Design and Analysis

Industry Trends on Low Power
RTL Design and Analysis

Monday, 10:00 AM - 12:00 PM

Workshop 2 - In-design Optimization for Accelerated Design Closure

In-design Optimization for Accelerated Design Closure

Monday, 2:00 PM - 4:00 PM

Workshop 3 - Chip-Package-SystemSimulation for Power, Signal and Thermal Analysis

Chip-Package-System Simulation
for Power, Signal and Thermal

Tuesday, 10:00 AM - 12:00 PM

Workshop 4 - Reliability Challenges for Advanced SoC and IP Designs

Reliability Challenges for
Advanced SoC and IP Designs

Tuesday, 2:00 PM - 4:00 PM

REQUEST PARTICIPATION >

Best Practices Seminars

These seminars will cover industry leading practices in the area of power analysis, power/signal integrity, thermal reliability, EM/ESD reliability and chip-package-system interactions. You will discover how ANSYS simulation platforms are used to solve current industry problems, and get the opportunity to ask questions of our subject matter experts.



  • Ensuring Silicon Success on Sub 16nm Ultra-Large SoCs

    Ensuring Silicon Success on Sub 16nm Ultra-Large SoCs

  • Reliability Analysis for Next Generation Fan-Out Wafer-Level Packaging

    Reliability Analysis for Next Generation Fan-Out Wafer-Level Packaging

  • Ensuring ESD Robustness for IPs and SoCs

    Ensuring ESD Robustness for IPs and SoCs

  • Accurate On-die Modeling Needs for System Level PI, SI & Thermal Needs

    Accurate On-die Modeling Needs for System Level PI, SI & Thermal Needs

  • Optimizing Die-size Using In-design Analysis

    Optimizing Die-size Using In-design Analysis

  • Power-Noise and Reliability for Analog & Mixed Signal IPs

    Power-Noise and Reliability for Analog & Mixed Signal IPs

  • Six Steps to Low Power RTL Design

    Six Steps to Low Power RTL Design

  • Monday, 12 PM
    Wednesday, 11 AM

  • Tuesday, 4 PM
    Wednesday, 3 PM

  • Wednesday, 12 PM

  • Monday, 1 PM
    Wednesday, 1 PM

  • Tuesday, 1 PM
    Wednesday, 10 AM

  • Monday, 5 PM
    Tuesday, 5 PM

  • Monday, 4 PM
    Wednesday, 2 PM

REGISTER >

Advanced Process Technologies and EM/IR Sign-off– co-presented with Intel Custom Foundry  (Tuesday, 12 PM)

 

ANSYS Solutions in DAC Designer Track

Visit DAC Designer Track sessions to obtain an in-depth view of the challenges faced within the industry and show you how companies are using technology to solve those challenges.

DESIGNER TRACK SESSIONS >

Industry Vertical Solutions

Come visit us to understand how the ANSYS solutions are used to solve problems in the Automotive, IoT and Mobile industry. These presentations will cover a full suite of solutions for reliability, electromagnetics, mechanical and thermal simulations in these industry verticals. They will take place at our booth theater at the times listed below. Everyone is welcome to attend.

Automotive Simulation to Ensure Safety and Reliability

Monday 4:15 PM; Tuesday 12:15 PM

Automotive Simulation to Ensure Safety and Reliability

Shrinking IoT Product Development Time from Concept to Production with Simulation

Monday 12:15 PM; Tuesday 4:15 PM

Shrinking IoT Product Development Time from Concept to Production with Simulation

Simulation Platforms for Mobile System Design

Tuesday 4:15 PM; Wednesday 12:15 PM

Simulation Platforms for Mobile System Design

Foundry & Partnerships

ANSYS works with leading foundries and IP partners across the globe to ensure our customers have access to the latest qualified technology collateral and reference flows. ANSYS partners with the following foundries. Please visit us at the following events:

Global Foundries
samsung
tsmc
Contact