The growing complexity of today’s electronic products pose significant challenges for chip and system designers that need to be addressed from early in the design process through final delivery. As a designer, how do you know that your chip will perform as expected, not only on its own but also within the context of the full system?
Will your design meet the required power-performance targets?
How do you validate electromigration reliability against true thermal conditions?
Is your design protected against potential ESD events?
Have you considered the impact of package on chip’s power delivery network?
How do you know if your design is EMI-compliant at system-level?
ANSYS comprehensive engineering simulation platforms enable chip and system designers to achieve faster power design closure and first silicon success. Visit us at DAC Booth 1232 to hear our domain experts and industry leading customers share their best practices for creating the most advanced high-performance, low power designs for automotive, mobile, IoT and other applications.