SIwave for Power Integrity

From Dimensions of Electronic Design Seminar, 2012: Advanced power integrity simulations allow engineers to understand how changes in their designs affect device operation and power plane noise. In this presentation we exhibit a chip-package-board simulation method using ANSYS SIwave and ANSYS Designer SI with Apache Chip Power Models (CPM) from RedHawk. The package is modeled using static S-parameters and the board is extracted in SIwave. Plane impedance, board resonances, and simultaneous switching noise simulations provide insight into the performance of the power distribution network and we optimize the decoupling capacitor solution on the board using ANSYS PI Advisor. The presentation also introduces some of the new features of SIwave 7 as they relate to power integrity simulation.

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