One Way Coupling Of CFX And ANSYS For Thermal Stress Analysis
With the release of ANSYS 11.0, the process of performing fluid structure interaction analysis has been significantly streamlined. In this brief demonstration, we will review the process of performing thermal stress analysis for a T-junction assembly. CFD analysis including heat transfer in the solid ws will be performed in ANSYS CFX. The temperature distribution on the inside ws is mapped onto the mechanical model and an ANSYS solution is performed in order to determine the resulting thermal stress and deformation. of this is performed in a single integrated CAE environment, ANSYS Workbench.