Power Loss due to Periodic Structures in High-Speed Packages and Printed Circuit Boards

In this paper we apply the basic principles of electromagnetic wave propagation in periodic media to explain the high frequency power loss resonances of Printed Circuit Board (PCB) interconnects observed in recent simulations and measurements. For this purpose we consider a simplified PCB trace buried in a one dimensional periodic media consisting of alternating dielectric materials resembling glass weave and resin patterns found in a typical PCB. We formulate distributions of electric and magnetic field components in each homogeneous region and solve them to get the relationship between fields in TE and TM waves in two equivalent layers with the same effective dielectric constant.

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