2020
Webinar
Modeling and Performance of Advanced Packages for HPC AI Applications
Ansys 2020 Innovation Conference: 3D-IC / 高速IC / 電源設計 Modeling and performance of advanced packages for HPC AI applications.
日月光半導體
電性實驗室 經理
郭宏鈞
產品系列
查看所有產品Ansys 致力於提供免費的模擬工程軟體給學生,以協助當今的學生獲得傑出的表現。
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