2020

Webinar

Modeling and performance of advanced packages for HPC AI applications

ANSYS 2020 Innovation Conference 3DIC / 高速IC / 電源設計 Modeling and performance of advanced packages for HPC AI applications.

日月光半導體
電性實驗室經理
郭宏鈞

SHARE THIS WEBINAR

Request Webinar

First Name *

Last Name *

Company or School *

Are You a Student? *

Email Address *

Country/Region *

State/Territory *

City *

Postal Code *

Ready to make the impossible possible?

Contact us

* = Required Field

Salutation

First Name *

Last Name *

Email *

Phone *

Country/Region *

State/Territory *

City *

Postal Code *

Company or School *

Job Level

Product Interest

Comments

Thank you for reaching out!

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.

Simulation Is A Superpower

The Power of Partnership

Women in Technology: Cybersecurity Expert on Why Diversity in the Industry is Important

Explore Opportunities

Discovery 30-Day Free Trial

What's Ahead for Electrification

What's Ahead for Commercial Aerospace

Find Training That Fits

Ansys Store

Speeding Wellhead Installation with a Quick Connect System

Ansys Learning Hub

Free Student Software Downloads Available

Take your simulations to the next level

Modeling and performance of advanced packages for HPC AI applications

SHARE THIS WEBINAR

Ready to make the impossible possible?

Ready to make the impossible possible?

Contact us

Thank you for reaching out!