This course demonstrates the workflow for analyzing layered structures using Ansys HFSS 3D Layout. This course includes integrating 3D Components and PCBs in HFSS 3D Layout design, Via optimization, modeling and analysis of passive and active circuits in HFSS 3D Layout, and ECAD Xplorer workflow to preprocess large GDSII format files before translating them to HFSS 3D Layout. This course is designed for the workshops to be used and these workshops instruct different applications following realistic workflows from start to end.
- Prior knowledge of Ansys HFSS 3D Layout Getting Started course is required.
- Knowledge of printed circuit board design including vias, component reference designators, and layer stackups is valuable.
Electronic engineers working with high-speed printed circuit board (PCB) design and signal integrity.
Hands-on simulation workshops to develop familiarity and productive skill in using HFSS 3D Layout.