Electronics systems are becoming more and more compact and require sophisticated optimization techniques to achieve optimal performance. The growing complexity of the design space makes it very difficult for engineers to identify the key variables that need to be optimized. A multiphysics solution is needed.
Attend this webinar to learn about a leading-edge optimization procedure applied to the thermomechanical setup of an electronics system. The procedure involves multiphysics thermomechanical analyses using ANSYS Icepak and ANSYS Mechanical, followed by system optimization using ANSYS optiSLang within the ANSYS Workbench framework. Using this process, you can optimize your design for minimal heat sink mass, fan flow rate and thermal stress while constraining the temperature within a given limit.