Ansys delivers the most comprehensive suite of physics-based simulation solutions for the telecommunications industry. Our industry-leading software capabilities support expansive telecommunication applications, including 5G. Ansys simulation software meets the accuracy and reliability requirements for simulating real-world performance of complex 5G equipment, systems and devices.
In this webinar series, we will showcase how Ansys simulation solutions are used by the telecommunications industry to design and analyze a vast array of next-generation applications which help drive organization-wide digital transformation objectives.
On Demand Webinars
5G and the Connected Vehicle
Presenter: Markus Laudien
Establishing a connected vehicle infrastructure requires 5G technology and a stable link across a variety of communication channels. Simulating these scenarios allows engineers to predict reliability and requires advanced asymptotic solvers for managing key geometry size versus wavelength tradeoffs and the handling the model geometry complexity. In this webinar, the advanced shooting and bouncing Ray (SBR+) method within Ansys HFSS will be presented as solution. We will address the placement of antennas, setup of moving trajectories and how to import models — including vehicles, areas of a street or parts of a city — to support your simulation. Additionally, critical post-processing capabilities and recommended solver settings will be discussed.View Now
Placing Antennas with Ansys HFSS SBR+ Simulation
Presenter: Markus Laudien
Application areas like 5G and radar systems often require the simulation of antenna placement on large vehicles and buildings. This is usually a challenging task due to the geometry size versus wavelength tradeoffs and the complexity of the model geometry. Asymptotic solvers are known to be a solution for these applications. In this webinar, the highly accurate shooting and bouncing ray (SBR+) method within Ansys HFSS will be presented as an advanced solution. A live demonstration will spotlight how it can be combined in a hybrid simulation approach with finite-element boundary integral (FEBI) domains or reading in far-field or near-field sources. Additionally, key post-processing capabilities and recommended solver settings will be discussed.View On Demand
5G Design Innovation Through Simulation
Presenter: Shawn Carpenter
With the progression of wireless communication networks from 4G to 5G, mobile networking is unlocking enormous benefits for businesses and consumers alike. Applications and business opportunities will soon become available that were previously beyond imagination. As the road to 5G and beyond presents significant challenges for technology providers, those who can offer timely solutions with the highest reliability stand to gain tremendous benefit and increase market share.
This presentation showcases the past, present and future of mobile networking, and how the convergence of 5G, edge computing and artificial intelligence machine learning will change the industry landscape. Modeling and simulation will drive this revolution—particularly in combining the physics of electromagnetics, optical, thermal, mechanical, and materials. Additionally, digital twins for modeling wireless devices within virtualized, realistic, city-sized environments will reduce the need for costly prototypes and exploratory testing in physical installations.View on Demand
Simulating Human Exposure to 5G Radiation
Most 5G applications directly concern user equipment with wireless devices in close proximity to human beings, so assessment of human exposure is a crucial aspect for device manufacturers. Furthermore, a much higher density of infrastructures will force 5G base-stations to be closer to people than is common with current cellular infrastructure.
In this webinar, we provide an overview of the main challenges related to human exposure assessment to 5G electromagnetic fields, highlighting the growing importance of numerical approaches and their benefits compared to measurement. In particular, the capabilities of state-of-the-art simulation solvers will be demonstrated by showing examples of SAR and power density evaluation on realistic test cases.View on Demand
3D Component Arrays Demonstration
The design of large antenna arrays is a challenging task for application areas like 5G and radar systems. Due to the complexity and the large number of excitations a simulation of the whole array —including couplings and edge effects — requires advanced solver techniques. In this webinar, the numerical technique of the domain decomposition based on 3D components within Ansys HFSS will be showcased with key examples. This approach allows the usage of non-identical array cells — operating at different frequencies — and highly parallelized solutions across multiple cores. A live demo will spotlight the setup procedure and post-processing capabilities will be presented, illustrating how you can define individual excitation for every individual cell as a post-processing operation.View on Demand
Exploring Ansys HFSS 3D Layout-Driven Assembly
Learn how to combine ECAD layout designs together, add mechanical CAD connectors or 3D component models in Ansys HFSS 3D Layout to accurately extract complex interconnect systems with 3D electromagnetic field simulation. This allows leading companies to break through the established silos of separate IC, package and board design and gain insight to the integrated IC-package-board design.View on Demand
Optimizing Speed with HFSS Regions in SIwave
Learn how the speed and accuracy of Ansys SIwave can be improved by leveraging HFSS Regions in SIwave, a cutting-edge technique for supporting high-speed printed circuit board (PCB) channel design requirements. This presentation compares the technique versus solely using Ansys HFSS, and explains how you can balance tradeoffs between accuracy, simulation speed, ease of use, and employing high-performance computing (HPC) options to solve 3D regions in parallel. Additionally, this webinar spotlights Ansys’ future plans for improving HFSS Regions in SIwave.View on Demand
Introduction to Ansys HFSS 3D Layout
Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components. HFSS 3D Layout is ideal for designers who work with layered geometry or layout high-speed components, including on-chip embedded passives, IC packages and PCB interconnects. These types of designs can be easily modeled in the HFSS electrical layout environment and simultaneously simulate all 3D features, such as trace thickness, etching, bondwires, vias, solder bumps and solder balls. Geometry such as trace width can be easily parameterized and optimized using the integrated Ansys Optimetrics tool within the HFSS 3D Layout interface.View on Demand