From component design to mission assessment, military electronics system development traditionally leverages a hierarchy of simulation tools — physics, systems, systems of systems and missions — that are often siloed, lacking integrated digital connectivity. This can result in a loss of fidelity as the simulations increase in scale, putting the mission at greater risk of late-stage problems.
A pervasive physics-based simulation environment that integrates all scales of models delivers persistent high-fidelity insight that can predict operational outcomes much more effectively. This identifies critical issues at all scales earlier, resulting in warfighters receiving required capabilities much faster.
In this forward-looking webinar series, Ansys experts — with decades of combined experience in military electronics and simulation — showcase integrated physics-based simulation approaches that can be deployed from the microchip to the mission.
Webinars on Demand
Hardware Security & Thermal Reliability for Mission Critical Electronic Design
Side-channel attacks and thermal reliability are key concerns for today's mission-critical electronics. Accurate and efficient analysis techniques to reduce or eliminate vulnerability to side-channel attacks are needed to prevent malicious attacks on secure communications.
Thermal effects limit both the performance and reliability of electronics across a wide range of uses including satellite communications, 5G, data centers and edge IoT.
We present solutions to these key problems with our flagship physics solvers and our Ansys SeaScape big data and AI platform.
Our discussion on thermal reliability highlights solutions for thermal analysis and power integrity from the architectural level all the way to the final system level, focusing on 3D multi-die packages.
During our discussion on security, we will present techniques for reducing vulnerability to side-channel attacks based on power-noise and electromagnetic radiation at the chip and board levels with proof points that spotlight potential vulnerabilities and solutions.
Improving PCB Performance & Reliability
This webinar demonstrates how to reduce failures and improve performance and product life by leveraging a coupled simulation workflow that integrates the analysis of electrical, thermal and mechanical reliability.
Modeling & Simulation for Installed Performance of Antennas
Designing and integrating coexisting RF sensor and communication systems is a growing challenge for today's multi-function platforms. Overcoming it may require high frequency electromagnetic analyses over a dimensional range that spans five or six orders of magnitude. This may include full platforms that extend thousands of electrical wavelengths in size.
This insightful webinar presents a cutting-edge workflow for synthesizing, optimizing and analyzing the installed performance of high-performance antennas and arrays. This will help characterize antenna systems in isolation and within intended installed environments.
From CAD to Co-site
The challenges of “dirty geometry”, obtaining effective antenna details and integrating system-level information from many engineering functions makes simulating an entire aircraft or vehicle platform’s radio frequency interference daunting.
This intriguing seminar showcases reliable methods and tools for overcoming these barriers and delivers a streamlined workflow involving state-of-the-art hybrid techniques.
By combining physics-based solvers with system-level behavioral models, a power flow approach is applied in the most efficient manner, achieving reliable simulation results that balance computational resources. This enables broadband co-site mitigation by using simulation for very large platforms.
Integrating High-fidelity Physics-based Simulations with Digital Mission Models
Watch this leading-edge webinar to learn how high-fidelity, physics-based simulations are integrated with mission simulators. Two real-world practical examples will be discussed, including a CubeSat thermal analysis and a Ka-band SATCOM antenna.