Introduction to ANSYS SIwave
Overview
SIwave is an advanced analysis and design tool for complex PCBs, packages, silicon interposers, and RDLs. Employing multiple state-of-the-art full-wave EM solvers, SIwave helps designers solve SI, PI, EMI/EMC problems of Chip/Package/Board systems. In addition to generating S-parameters, RLCG extractions, and SPICE netlists, SIwave offers an array of different analyses, including impedance scan, DC IR drop, time-domain reflectometry (TDR), and impedance optimization of PDN using decoupling capacitors. Ports, terminations, and circuit elements can be inserted into the design to set up the simulation and to model the system end-to-end.
This training course walks new ANSYS SIwave users through simulation steps to run various types of SI/PI analyses using real high-speed boards as examples. These steps include the use of AEDT (ANSYS Electronics Desktop) circuit simulation and post-processing capabilities.
Learning Outcome
- Know how to set up SI analyses in SIwave, including impedance scan, SYZ and TDR.
- Know how to set up PI analyses in SIwave, including SYZ, RLGC, and decoupling capacitor optimization.
- Know how to configure components including R, L, C, ports, terminations.
- Know how to configure SPICE and S-parameter component models.
Prerequisites
- Familiarity with high-speed digital signal electronic engineering, including transmission line characteristic impedance, differential pairs, NEXT (near end cross talk) and FEXT (far end cross talk), and S-parameters.
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Familiarity with printed circuit board (PCB) layouts, workflows (formats for import and export), and standards (e.g. DDR)
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Prior experience with full wave electromagnetic simulation is helpful but not required.
Target Audience: Electronic engineers involved in high-speed PCB design and validation, including both signal integrity and power integrity
Teaching Method: Lectures and computer practical sessions to validate acquired knowledge. A training certificate is provided to all attendees who complete the course.
Learning Options: Training materials for this course are available with a ANSYS Learning Hub Subscription. If there is no active public schedule available, private training can be arranged. Please contact us.
Agenda SUBSCRIBE TODAY
Date/Time | Duration | Event Type | Location | Language | Class Cost | ||
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January 21, 2021 9:30 - 16:30 CST (GMT +8) |
January 21, 2021 |
1 Session Jan 21 |
Live | Hsinchu , Taiwan | Chinese | 19500 TWD | Register › |
February 24, 2021 11:00 - 13:00 EST (GMT -5) |
February 24, 2021 |
3 Sessions Feb 24-26 |
Virtual | Virtual - WebEx | English | Subscription Only | Register › |
June 7, 2021 13:00 - 15:00 EST (GMT -5) |
June 7, 2021 |
4 Sessions Jun 07-10 |
Virtual | Virtual - WebEx | English | Subscription Only | Register › |
February 25, 2021 10:00 - 17:00 KST (GMT +9) |
February 25, 2021 |
2 Days Feb 25-26 |
Live | Seoul , South Korea | Korean | 700000 KRW | Register › |
April 8, 2021 10:00 - 17:00 KST (GMT +9) |
April 8, 2021 |
2 Days Apr 8-9 |
Live | Seoul , South Korea | Korean | 700000 KRW | |
June 8, 2021 10:00 - 17:00 KST (GMT +9) |
June 8, 2021 |
2 Days Jun 8-9 |
Live | Seoul , South Korea | Korean | 700000 KRW |