Material Characterization

One of the biggest challenges standing in the way of pervasive simulation across all industries is the lack of shared data between supplier and customer. Often, data sheets provided by suppliers do not contain critical information needed by the engineer or designer, such as material properties that are necessary for accurate model inputs. Even if the supplier has the necessary information, intellectual property rights concerns can often prevent a full and robust data exchange up and down the supply chain. This lack of information stifles the design and simulation process and causes misunderstandings that can result in unnecessary delays or significant warranty claims.

Ansys offers materials characterization services that provide solutions for missing component data. This service includes:

  • Electrical characterization
  • Mechanical characterization
  • Reliability characterization

Our electrical characterization process provides important parametric information about electronic components and printed circuit boards (PCBs). This capability includes basic information, such as VI curves and timing, to more complex behaviors, such as electromagnetic radiation and high frequency impedance.

Our mechanical characterization process accurately captures the necessary geometry and material properties to perform robust simulation of electronic packages, assemblies and entire systems. The Ansys team specializes in precise part deconstruction including 3D X-ray, digital image correlation (DIC) and decapsulation as well as temperature-dependent characterization of both on-board (i.e., underfill) and off-board (i.e., glass-filled housing) materials.

Our reliability characterization process utilizes accelerated life testing (ALT) to analyze how a productor component will function under stressors i.e., temperature changes, shocks or vibrations) at a much faster rate than in the field. Our work provides customer with data to perform powerful post-processing life predictions, including parametric shifts in integrated circuits (i.e., memory, CPU, ASIC, etc.), fretting behavior of connectors and fatigue/creep parameters of adhesives.

Important aspects of Ansys reliability engineering services (RES) material characterization:

  • Our simulation experts know exactly which data needs to be extracted and select the best form for simulation.
  • We are directly linked to Ansys Granta MI, enabling you to maximize your ROI by empowering your colleagues with unlimited data access.

At Ansys, we are committed to offering a RES suite dedicated to providing our customers with the tools needed for improved product performance, superior product design and faster time to market. Learn more about Ansys’ RES capability and how it can help you reach your business goals.


6 Steps to Successful Board Level Reliability Testing

6 Steps to Successful Board Level Reliability Testing

A 6 step guide to performing meaningful and relevant board level reliability testing for the semiconductor industry.

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