Integrated Circuit Reliability

Integrated circuit (IC) components are part of nearly every major electronics application. However, up to this point, most reliability assessments focused on meeting the demand of consumer applications that last an average of five years. Today, many emerging market segments require reliable operations for 10 to 15 years, even in severe environments. Robust prediction of IC life in modern, high-reliability applications requires a different approach.

With a foundation in reliability and semiconductor physics, the Ansys team uses simulation, testing and teardown analysis to define failure risk in specific applications and identify the key drivers of IC reliability. Whether you are trying to reduce component integration risk in a new application or trying to solve an IC reliability challenge in a severe environment, our experts have the experience and resources to help.

Traditional simulation and modeling techniques for ICs require extensive design, manufacturing and test information that is not typically available to IC integrators and product designers. Our approach brings simulation and modeling within reach by using data they can typically acquire. Based on proven methods, our approach uses information about the technology node and functional blocks within the IC to predict susceptibility to hot carrier injection, negative bias temperature instability, time-dependent dielectric breakdown and other common IC failure mechanisms. We can simulate the reliability of ICs in application-specific environments and help designers mitigate IC reliability concerns early in the development process.

Ansys also designs and conducts environmental testing of ICs under load and can evaluate bit errors and other signs of wear through in situ monitoring and failure analysis, as appropriate.


Case Study: Semiconductor Wearout Life Prediction

The auto manufacturer requested a wearout life prediction analysis on potential high-risk components.

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