Ansys 2021 R1: What’s New in Ansys Icepak — Mechanical Thermal Solution
Join us to learn about a new Ansys Mechanical design type — the Mechanical Thermal solution — now available inside Ansys Electronics Desktop (AEDT). This solution streamlines the workflow linking electromagnetic designs from Ansys HFSS, Ansys Maxwell and Ansys Q3D Extractor for quick thermal insight. Register to learn more about: How to use the new Mechanical Thermal solution to quickly connect to electromagnetic designs How to use the reduced order modeling (ROM) workflow with Icepak in AEDT How to take advantage of the enhanced network boundary conditions in Icepak Register for this webinar detailing all the significant advances in Icepak. Speaker: Jim Delap, Product Manager Bio: Jim DeLap is Director for Electronics product management at Ansys. He has worked in the microwave and RF community for over 25 years, and has a master's degree from the University of Virginia. He specializes in high-frequency and millimeter-wave IC and module design with further emphasis on thermal and electromagnetic effects in ICs and packages.
Ansys 2021 R1: Overset Meshing Update
This webinar will highlight all the major enhancements in Ansys Fluent for Overset meshing methods in Ansys 2021 R1, including: A new streamlined meshing workflow that accelerates the pre-processing time by orders of magnitude. A way to create the Overset meshes in a single meshing session, automatically refine mesh near overlap regions and utilize body of influence for volume refinement. A method for identifying orphans directly in the meshing workflow to allow immediate mesh size changes. The capability to combine dynamic mesh adaption and solution adaption with Overset meshing method. Solver improvements that generate 20-30% performance gains over previous releases.
Ansys 2021 R1 Update: What's New in Ansys optiSLang
Discover the latest enhancements in Ansys optiSLang in our latest release, Ansys 2021 R1, including: Better connection to CAx tools: Ansys optiSLang improves process integration by supporting the scheduler submit function in Ansys Electronics Desktop and Ansys HPC licensing. More efficient monitoring and workflow control: Better control and monitoring of the workflow through the new status overview function. Easy web-app building and publishing in Ansys Minerva integration allows enterprise-wide application of PIDO simulation workflows. Better product in less time: Benefit from more efficient algorithms as the reworked nature-inspired optimizers and Adaptive MOP now support single- and multi-objective optimization.
5G Design Innovation Through Simulation
With the progression of wireless communication networks from 4G to 5G, mobile networking is unlocking enormous benefits for businesses and consumers alike. Applications and business opportunities will soon become available that were previously beyond imagination. As the road to 5G and beyond presents significant challenges for technology providers, those who can offer timely solutions with the highest reliability stand to gain tremendous benefit and increase market share. This presentation showcases the past, present and future of mobile networking, and how the convergence of 5G, edge computing and artificial intelligence machine learning will change the industry landscape. Modeling and simulation will drive this revolution—particularly in combining the physics of electromagnetics, optical, thermal, mechanical, and materials. Additionally, digital twins for modeling wireless devices within virtualized, realistic, city-sized environments will reduce the need for costly prototypes and exploratory testing in physical installations.
Modeling and Simulation of 5G Antenna System Innovations
Ansys has developed a breakthrough technology, known as 3D Component Domain Decomposition Method (3D Comp DDM), that enables the accurate and efficient simulation of antenna arrays. Whether solving complex, electrically large antenna arrays, or relatively simple antenna arrays, this technology enables fast simulation without compromising on accuracy. 3D Comp DDM enhances the simulation process offering a robust and scalable solution for modeling realistic arrays while capturing finite array truncation effects. In this presentation, a workflow for the analysis of 5G phased array antennas and hand-held antennas will be demonstrated.
Systematic Cybersecurity Threat Analysis and Risk Assessment
The digital revolution has produced vehicles with unprecedented connectivity, which makes them vulnerable to cyberattack. Ansys medini for Cybersecurity helps secure in-vehicle systems and substantially improves time to market for critical security-related functions. It addresses the increasing market needs for systematic analysis and assessment of security threats to cyber-physical systems, starting early in the system design phase. In this webinar, we demonstrate how systematic cybersecurity analysis mitigates vulnerability to hacking and cyberattacks. Attendees will: Learn how to identify assets in the system and their important security attributes Discover new methods for systematically identifying system vulnerabilities that can be exploited to execute attacks Understand the consequences of a potentially successful attack Receive expert tips on how to estimate the potential of an attack Learn how to associate a risk with each threat Leverage new tools for avoiding overengineering and underestimation
Ensure 5G Systems Integrity by Using Multiphysics Analysis of Chips, Packages and Systems
The evolution of 5G systems is rooted in the consistently increasing need for more data. Whether the application is future medical systems, autonomous vehicles, smart cities, AR/VR, IoT, or standard mobile communications systems, all require an ever-increasing amount of data. For 5G systems to reliably work, the physical data pathways must be well understood and reliably designed. Whether the pathway is in the chip or the wireless channel, large amounts of data must seamlessly flow unimpeded. This presentation will discuss the various data paths in 5G systems and how Multiphysics analysis can help design these paths to allow for maximum data integrity.
Why Do I Sometimes See Negative Mutual Inductance in 2D Extractor - White Paper
Sometimes 2D Extractor returns an inductance (L) matrix whose entries cause concern. Some users are surprised to see a negative off‐diagonal term in the inductance matrix (mutual inductance) because these entries are often all positive. Please be assured that these results are correct and not a cause for worry. This note attempts to explain why this is so.
HPC as Easy as It Should Be with Microsoft Azure
To combine the benefits of cloud computing and best-in-class engineering simulation, Ansys is partnering with Microsoft Azure to create a secure cloud solution: Ansys Cloud. Learn more about Ansys Cloud capabilities and how they empower our customers to speed up innovation by running complex simulations in a short time. After a brief introduction to Azure HPC followed by an overview of Ansys Cloud, we introduce a customer who uses Ansys Cloud today. This customer discusses the benefits they realize in a very competitive industrial market and demonstrate how Ansys Cloud is helping their business.
Materials Education with Ansys Granta EduPack 2021 R1
Ansys Granta EduPack is the leading software used by educators at over 1,400 educational institutions worldwide to introduce engineering students to materials and material selection for mechanical design. Join this webinar to learn what’s new in Granta EduPack and how it can support your materials teaching. What you will learn How Granta EduPack can help you engage and inspire your students How to combine materials data from Granta EduPack with simulation to enable in-depth materials selection in mechanical design How to use the advanced data and tools in Granta EduPack to enhance interdisciplinary design projects Who should attend? University and College academics who teach materials-related subjects in Mechanical Engineering or related disciplines.
Ansys 2021 R1: Fluent Update
This webinar will highlight some of the major enhancements in Ansys Fluent in our latest release, Ansys 2021 R1. New capabilities and innovative features in this release will help boost productivity and reduce time to accurate results. Learn about the new updates from pre-processing and user experience to new modeling capabilities, including: User Experience and Interface Fluent for designers: get the same user-friendly interface and industry’s most accurate solver, with limited capabilities for solving less complex CFD simulations Post-processing features, embedded graphics windows and a dark theme Expressions capabilities and improved usability Simulation reports that compile key aspects of your setup; results can be exported as HTML or PDF formats Pre-processing A streamlined overset meshing workflow Parallel meshing improvements Physics and Solver New multiphase models and solver improvements High speed flow improvements with high speed numerics and a thermal non-equilibrium model Accelerated thermal management simulations Aeroacoustics and sound playback Single-window thermoelasticity simulations
Ansys 2021 R1: Ansys SPEOS Latest Advances
Discover the advances in Ansys SPEOS included in the latest release to increase the reliability of ADAS and AV simulations, maximize lidar detection capabilities, accelerate optical simulation time using Ansys Cloud and increase productivity through automated functions. Attend this webinar and discover the advances included in Ansys SPEOS in the latest release. This new version accelerates innovation with improved workflows, innovative features and new capabilities, including the ability to: Increase the reliability of your ADAS and AV simulations by taking optical sensors to a new level of realism with scanning and rotating lidar models. Maximize lidar detection capabilities with smarter algorithms thanks to raw time of flight signal analysis. Accelerate optical simulation time and get results up to 60X time faster using Ansys Cloud. Access SPEOS from the Cloud Desktop, and combine your optical simulations with other Ansys solutions, such as Ansys Mechanical, Ansys Fluent and Ansys optiSLang, for streamlined and comprehensive simulation results. Increase productivity with new automation capabilities, providing complete access to all SPEOS parameters. Automate repetitive tasks and perform advanced analysis intuitively. Benefit from recording functions and autocompletion capabilities, making scripting easy even for non-experts.