HyperXite Uses Ansys Discovery to Design a Safe Hyperloop Pod
HyperXite, an undergraduate team from the University of California, Irvine (UCI), relies on Ansys Discovery during early design exploration for the SpaceX Hyperloop competition. Learn more about Ansys’ role in the safe and reliable design of HyperXite’s Hyperloop pod. Interested in Ansys sponsoring your competitive student team?
EVNAT Revolutionizes Fluid Storage with the Use of Ansys Tools
Using the Ansys Startup Program’s Structural and Fluids Bundle, EVNAT created a jet mixing device for tanks to store liquid media in large volumes.
Team Bath Racing uses Ansys Software to provide Accurate FEA and CFD Data and Analytics
Team Bath Racing uses Ansys engineering simulations to reduce design time and the need for costly prototyping and physical testing.
Using Ansys Granta Material Data Simulation (MDS) with Ansys Electronics Desktop - One Minute Demo
Using Ansys Granta Material Data Simulation (MDS) with Ansys Electronics Desktop
Using Ansys Granta Material Data Simulation (MDS) with Ansys Fluent - One Minute Demo
Using Ansys Granta Material Data Simulation (MDS) with Ansys Fluent
Ansys VRXPERIENCE Sound ASDforEV
VRXPERIENCE Sound ASDforEV delivers in-vehicle sound design and tuning that is designed to predict, test and validate the future soundscape of vehicles in real-world driving conditions.
Ansys Minerva XPLM Datasheet
With Ansys Minerva, the leading simulation and process data management solution, the new ecosystem connectors — powered by XPLM — allow you to connect simulation to multi-discipline design and to the full product lifecycle. The XPLM integration solution enables collaboration between those involved with simulation, the mainstream design process and cross-functional decision-making. Simulation results and analysis conclusions are now accessible across the enterprise, supporting multi-domain scenarios and therefore impacting productivity.
Developing Damage Models to Predict Solder Fatigue
Solder, which provides the structural and electrical connection between a printed wiring board (PWB) and electrical components, is the dominant material used for assembling electronics. However, solder is also one of the few structural materials that is expected to undergo significant inelastic deformation during its lifetime. Inelastic deformation damages solder, which can lead to eventual solder joint failure. Predicting when the solder joint fails is critical when using solder in harsh use environments. These harsh environments have loads that can come in several forms (i.e., drop/shock, vibration, temperature cycling). The majority of solder fatigue in electronics is thermomechanically driven due to temperature cycling which causes significant deformations and stresses due to coefficient of thermal expansion (CTE) mismatches between the PWB and components. In order to predict solder failure, a damage model must be used that relates deformation of the solder to cycles to failure. In this webinar, we will discuss material characterization of various solder alloys, predictive solder fatigue damage models using a physics-of-failure approach (PoF) and how to develop damage models using simulation and testing.
Optical and Radiometric Simulation for Biomedical Applications
The development of new methods and instruments requires an in-depth understanding of light’s propagation and interaction with biomedical samples. Ansys simulation tools are thus required to model the properties of the instrument and the tissue sample or the organ under investigation. To calculate light propagation of the involved media, cutting-edge simulation solutions are required. Additionally, optical properties of the media, especially its spectrally resolved scattering and absorption parameters, must be determined. This webinar explores basic concepts for calculating the light propagation in biological tissues (e.g. using Monte Carlo simulations) and for determining scattering and absorption spectra of biological tissues. Examples of optical simulations for biomedical applications will be presented and several use cases for Ansys optical modeling of biomedical systems will be discussed.
Hardware and Usability Guidelines for Engineering Simulation
This webinar will provide insight into how you can optimize your hardware and software deployments for best performance. Hardware selection for engineering simulation software is often a confusing undertaking; performance can significantly vary with workload, which depends on the dataset size and solver utilized. Optimizing detailed hardware configurations that match both expected performance, usability and budget can be a challenge. Watch this recording to hear from Ansys and Intel and: Discover hardware selection guidelines for processors, memory, interconnects and storage systems. Learn how to unleash your performance through usability guidelines on modelling, remote visualization and licensing. Explore alternatives to a hardware implementation and find out how cloud computing can deliver on-demand, high-performance computing (HPC).
Simulation Tools for Product Designers
Traditional product design teams spend a lot of time coordinating with analysis and physical testing teams, which leads to long design cycles. As industries become more agile, it is necessary to reduce design time by equipping engineers with intelligent design tools to accelerate the process. Learn how Ansys Discovery can help you perform upfront design optimization by leveraging predefined templates for input parameters in real time and generating early insights into product behavior. Its integrated user interface and flexible design workflows help you to spend more time perfecting the design and less time coordinating operations between teams.
The number and variety of materials available today are increasing at a rate faster than at any previous time. The next generation of engineers – the ones we are educating now – will need to use materials of all sorts (conventional as well as advanced) in ways that meet more demanding technical, environmental, economic and aesthetic requirements. Learn how Ansy Granta EduPack provides engineering students with the materials knowledge they need to be successful in today's competitive environment. Granta EduPack is a complete set of resources, with the central software supported by supplementary databases, textbooks, lectures, projects and exercises. By proceeeding through the three levels of Granta EduPack, students gain the knowledge and confidence to select materials for mechanical, thermomechanical and electromechanical designs, and develop an understanding of processes for forming, joining and surface treating the materials. The application of such materials information technology is becoming increasingly important in industry as materials and manufacturing organizations seek to optimize their materials strategies in order, for example, to control costs in global markets, to incorporate eco-design principles in response to market demand and increased environmental regulation, and to limit the use of restricted substances.