Why Electrical Overstress Ranks High in the Failure Pareto

The semiconductor industry has witnessed steady growth over the last few years thanks to emerging applications, which are driving the growth of major semiconductor components. Reliable operation of these components is very important in any given application and to ensure reliability, component parts must receive extensive testing and burn-in. Despite this, integrated circuit (IC) failures are still inevitable.

One of the common failure mechanisms that affects all IC components, irrespective of the type of application, is electrical overstress (EOS). This phenomenon can affect components without warning, and when EOS does occur, the damage is done, leading to unrecoverable functionality.

This webinar discusses the possible root cause of EOS failures, why it ranks high in the failure pareto, and how you can mitigate EOS failure risks.

Share:

I want to receive updates and other offers from Ansys and its partners. I can unsubscribe at any time. ANSYS Privacy Notice

Start a conversation with Ansys

Contact Us