Thermal Management of Electronics in Drilling and Completion

Planning and finishing an injection well often uses important data regarding the geological formation around the well and the integrity of the engineered well bore. The data combines information including radio-active signature, porosity, connectivity, drilling direction, cement bonding, flow, temperature, etc. Engineers typically collect accurate well data during the drilling and completion stages using sophisticated electronic circuitry, sensors and actuators to process this data. Data transfers to the surface through wireline tools or saves onto media, both of which require the use of additional sophisticated electronics.

The temperature can significantly affect the reliability of the electronic devices. While failure temperature of electronics components and solder remains relatively consistent, the ambient well temperature increases at the rate of 25 to 30°C per kilometer. The reduced operating temperature band and prolonged exposure to the drilling environment necessitates better thermal management of electronics.

In this webinar we examine how ANSYS tools can be used for thermal management and packaging of electronics in down-hole tools.