Thermal Integrity and Thermal-Aware EM Reliability Check for 3D Stacked Dies in EV-HEV

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Power and performance are key requirements for EV/HEV. The electronics in a modern automobile must operate in a high temperature environment — such as under the hood — without sacrificing performance. Thermal integrity and thermal-aware reliability are some of the biggest concerns that can affect power (leakage), IR, timing and electromigration (EM).

Learn how Freescale uses Ansys RedHawk, SIwave, and Sentinel-TI to design 3D stacked dies (memory on top of SoC) that can improve power consumption and channel communication speed, while mitigating thermal interaction and reliability issues. Discover how Freescale’s model-based thermal-aware power noise and reliability methodology can help you improve your 3D stacked die design.

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