The Reliability of BGAs, QFNs and Other Critical Packages
There are many factors that determine the thermal cycling robustness of an electronic package. Packages that have known thermal cycling issues include ball grid arrays (BGAs), quad flat no-leads (QFNs) and ceramics. This presentation discusses the critical parameters of these packages that may affect the thermal cycling performance. The webinar also covers other possible reasons why your electronic product may not be robust with regards to thermal cycling.