Icepak Advancements Overview

In this webinar, you will learn about the new electronics cooling capabilities offered with ANSYS release 14.5. The update will include a presentation on the improvements in usability for electronics cooling, and new advanced thermal modeling capabilities for IC packages and printed circuit boards. During this presentation, you will also learn about innovations in multiphysics coupling of electromagnetics and thermal simulation for increasing the fidelity of electronic designs.
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