Hardware Security & Thermal Reliability for Mission Critical Electronic Design

Side-channel attacks and thermal reliability are key concerns for today's mission-critical electronics. Accurate and efficient analysis techniques to reduce or eliminate vulnerability to side-channel attacks are needed to prevent malicious attacks on secure communications.  

Thermal effects limit both the performance and reliability of electronics across a wide range of uses including satellite communications, 5G, data centers and edge IoT.

We present solutions to these key problems with our flagship physics solvers and our Ansys SeaScape big data and AI platform.  

Our discussion on thermal reliability highlights solutions for thermal analysis and power integrity from the architectural level all the way to the final system level, focusing on 3D multi-die packages.

During our discussion on security, we will present techniques for reducing vulnerability to side-channel attacks based on power-noise and electromagnetic radiation at the chip and board levels with proof points that spotlight potential vulnerabilities and solutions.

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