ANSYS Icepak 15.0 Advancements Overview

In this one-hour webinar, you will learn about the new electronics cooling capabilities in ANSYS 15.0. The update will include a presentation on the improvements in usability for electronics cooling simulation, new options for optimization and parametric analysis, and modeling the mixing and transport of multiple species. During this presentation, you will also learn about innovations in multiphysics coupling of electromagnetics and thermal simulation for increasing the fidelity of electronic designs.