10x More Productivity for Chip-Package-System Workflows - Webinar

The Internet of Things (IoT), autonomous vehicles and smart devices have two major components in common: sensors and antennas. These components collect data and transmit it throughout systems of various sizes, ranging from inside an automobile to across a country. This has presented engineers with new design challenges regarding connectivity, performance, power efficiency and achieving first-time success.

Learn how ANSYS 17.0 has enhanced the Chip-Package-System workflow to address design challenges in power integrity, signal integrity, ESD, thermal and structural challenges. Discover how ANSYS solutions provide a unique virtual prototyping flow to simulate the real-world electrical, thermal, and mechanical behaviors of a product, allowing design engineers to meet their system power and performance targets, while reducing cost.
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