SIwave-DC for Power Integrity Analysis - Video

video-thumbnail

See how SIwave-DC can help you optimize Power Delivery Network design.

Back To Resource Library

Share:

Request Now

I want to receive updates and other offers from Ansys and its partners. I can unsubscribe at any time. ANSYS Privacy Notice

Recommended

Cutting the Cords - Article - ANSYS Advantage - V12 I2

Networking experts predict that, by 2021, 66 percent of all internet traffic will be used for high throughput services such as wireless docking, video streaming, cloud backup and virtual reality. Peraso Technologies enables users to cut the cord and go wireless by providing chipsets based on the emerging 802.11ad (WiGig) standard that delivers high-speed wireless throughput in a USB 3.0 stick form factor. Peraso engineers used ANSYS simulation software to solve thermal problems associated with packing high power transmitters into a tiny enclosure.

Deep Channel Analysis for High-Speed Interconnect Solutions - Article - ANSYS Advantage - V11 I3

Data center servers, storage and networking equipment communicate over copper and optical cable assemblies joined by ever-faster connectors. Samtec leverages a comprehensive suite of simulation software from ANSYS to design and optimize next-generation, high-performance interconnect solutions across the entire signal channel.

Driving Innovation with Electronics - Article - ANSYS Advantage - V11 I3

Electronics are pervasive in our world today. From electric machines to high-speed electronic devices to antennas and wireless communication, the demand continues to grow. However, designing innovative products to work reliably in the real world becomes more difficult with the need to reduce energy consumption, avoid interference with other devices and decrease development time. Leading companies leverage engineering simulation to quickly bring to market pioneering products that meet and exceed expectations.

Getting on Board with Vias - Article - ANSYS Advantage - V11 I3

It is not uncommon to have a design fail in the field due to signal integrity issues even though simulation shows it should work perfectly because the as-manufactured product differs from the design definition. To avoid this problem, the signal integrity engineer needs to understand what will actually be delivered and use simulation to verify that the frequency- and time-domain performance will meet the design requirements. Simulation can be used to address the question of how differences between as-designed and as-built vias might degrade time- and frequency-domain performance of printed circuit boards (PCBs).

A Via Runs Through It - Article - ANSYS Advantage - V11 I3

Signal integrity has emerged as a major issue in the design of high-speed electronics. While signal crosstalk has been a challenge for electrical engineers for some time, the proliferation of electronics in our lives amplifies the negative consequences of bad design practices. The ANSYS Electronics Desktop, which includes enhancements to ANSYS HFSS and ANSYS SIwave, is an essential tool for engineers looking to address electronic system reliability issues, such as signal integrity, power integrity and EMI/EMC. Interconnect Engineering, Inc. used these simulation tools to analyze a customer case involving a DDR3-800 board. They determined that unexpected crosstalk was originating in the BGA vias, and solved the problem by routing layers closer to the primary side of the PCB.

Crossed Signals - Article - ANSYS Advantage - V11 I3

Smart Modular Technologies engineers leverage the ANSYS Electronics Desktop platform to reduce the time required to perform signal integrity analysis of a high-speed printed circuit from days to hours. By using unified electromagnetic, thermal and structural simulation, engineers developed a reliable adapter.

Start a conversation with Ansys

Contact Us