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ANSYS France: Revolutionizing Product Development Cycles

From design and analysis to manufacturing and operations, ANSYS France drives cutting-edge engineering simulations, enabling unprecedented productivity. Engineering teams from a broad cross-section of industries are leveraging ANSYS simulation to radically reduce their development time and significantly spur their innovation. Learn how they have been so successful in this video.

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This video introduces you to the ANSYS Electronics Desktop environment and its intuitive ribbon interface that enables users to execute workflows for electromagnetic, thermal, and circuit analyses as well as multiphysics simulations. The video dwells on some of the advantages of using Electronics Desktop such as its clear visual layout, consistent look and feel, and its user-friendly interface which makes it easy to discover commands and work across multiple products. The video also provides a brief description of the commands on the various tabs of the ribbon for the different products within the Electronics Desktop.

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Enabling Silicon-to-System Success with ANSYS Multiphysics Simulations

The new era of semiconductors will enable transformational products for artificial intelligence (AI), 5G, automotive, networking, cloud and edge compute applications. Ubiquitous connectivity, low latency and faster data rates will enable billions of smart devices. These devices will rely on advanced, low-power FinFET designs and state-of-the-art 3D-IC packaging technologies to deliver the required power, performance, area and reliability goals. Multiphysics analysis is critical for designing these cutting-edge electronics systems to work reliably throughout their lifetime. ANSYS empowers customers with big data analytics, elastic compute scalability and multiphysics simulations to simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon-to-system success.

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Achieving Electronics System Reliability for 5G Designs

5G network infrastructure will rely on high-frequency mmWave spectrum, massive multiple- input-multiple-output (MIMO), small cells and beamforming and beam tracking capabilities. These will increasingly complicate the design of 5G systems that must now absorb huge amounts of antenna data, support a variety of 5G air interfaces — massive machine type communication (MTC), enhanced mobile broadband (eMBB) and ultra-reliable and low latency communication (URLLC) — and offer significantly higher processing capabilities within a power- and thermal-constrained environment. In this presentation, Dr. Norman Chang, chief technologist for ANSYS/semiconductors, addresses reliability challenges, including electromigration (EM), thermal-aware EM, thermal-induced mechanical stress, electrostatic discharge (ESD) and device aging: All are key for 5G electronics systems design to enable mission-critical applications of the future, e.g., self-driving cars.

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Exploring Key Features of the All-New Ansys Discovery

The all-new Ansys Discovery delivers simulation specifically built to be leveraged earlier in your product development process, enabling you to test multiple design ideas quickly in real-time, make changes and instantly view results. Or refine your most promising designs using high-fidelity simulation for increased confidence and product insight. Watch this video for a deep dive into how Discovery’s dynamic features will take your designs to the next level.