Achieving Electronics System Reliability for 5G Designs


5G network infrastructure will rely on high-frequency mmWave spectrum, massive multiple- input-multiple-output (MIMO), small cells and beamforming and beam tracking capabilities. These will increasingly complicate the design of 5G systems that must now absorb huge amounts of antenna data, support a variety of 5G air interfaces — massive machine type communication (MTC), enhanced mobile broadband (eMBB) and ultra-reliable and low latency communication (URLLC) — and offer significantly higher processing capabilities within a power- and thermal-constrained environment.

In this presentation, Dr. Norman Chang, chief technologist for ANSYS/semiconductors, addresses reliability challenges, including electromigration (EM), thermal-aware EM, thermal-induced mechanical stress, electrostatic discharge (ESD) and device aging: All are key for 5G electronics systems design to enable mission-critical applications of the future, e.g., self-driving cars.


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