Performance Improvement by System Aware Substrate Noise Analysis for Mixed-signal IC - Conference Paper

The market wants mixed ICs which is smaller and cheaper, and even provides advanced features. To satisfy with this contradiction, many mixed ICs makers are reducing BOM (Bill of Materials) cost by decreasing the amount of materials on package or board. But the cost-effective methods can cause significant performance degradation with intensified coupling effect due to substrate noise. The paper illustrates a chip failure case due to coupling noise by ground ball merge on package for cost reduction and introduces a system aware substrate noise analysis being able to reproduce chip failure and detect root cause of the chip failure. Lastly, the paper proposes performance improvement methods with cost reduction.
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