Hot Flash - ANSYS Advantage - Article - V10 I1

Using a reduced-order method, engineers at Fairchild Semiconductor have been able to decrease development time for electronic components for electric and hybrid electric vehicles. By employing ANSYS Icepak for thermal management and ANSYS Simplorer for multi-domain systems design the engineers can perform dynamic thermal analysis under realistic power loss conditions approximately 2,000 times faster than a full 3-D thermal analysis.