Careers
Academic
Customer Portal
Resource Library
Blog
- English, India
- English, UK
- English, US
- Français
- Deutsch
- Italiano
- 日本語
- 한국어
- 简体中文
- 繁體中文

Accurate Thermal Analysis Including Thermal Coupling of On-chip Hot Interconnect

Driven by rapid advancement in mobile/server computing and automotive/communications, system on chips (SoCs) are experiencing fast functional integration along with technology scaling. Advanced low-power techniques are widely used while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is further opening up new applications with connected devices and systems, where low power, high performance and reliability are paramount. Since the impact of temperature on power, performance and reliability is huge, accurate thermal analysis is a requirement for the design flow.

Back To Resource Library

First Name

Last Name

Company or School

Are you currently a student?

Email Address

Country / Region

State

City

Postal Code

Optin

I want to receive updates and other offers from Ansys and its partners. I can unsubscribe at any time. ANSYS Privacy Notice

Captcha

Electronics are pervasive in our world today. From electric machines to high-speed electronic devices to antennas and wireless communication, the demand continues to grow. However, designing innovative products to work reliably in the real world becomes more difficult with the need to reduce energy consumption, avoid interference with other devices and decrease development time. Leading companies leverage engineering simulation to quickly bring to market pioneering products that meet and exceed expectations.

View Article

Excellence in Engineering Simulation - Article - ANSYS Advantage - V5 I2

ANSYS Advantage showcases how engineering simulation is driving product development. From a bottle warmer. to electronic throttle controls to landmark buildings, engineers are designing better, more reliable products. Engineers who design turbomachinery are improving performance and by simulating entire systems, determining the effects of erosion and employing ANSYS Workbench and high-performance computing as a best practice for design. Other articles demonstrate how researchers are reducing surgery for children, one of the ways that The Dow Chemical Company is contributing to environmental sustainability and how direct modeling is improving the design of a pellet stove.

View Article

Enabling the Future for Electronics - Article - ANSYS Advantage - V11 I3

As electronics become more and more pervasive in our lives and businesses, the complexity of design increases exponentially, requiring advanced electronics simulation to develop the reliable products we can no longer flourish without.

View Article

Shifting Left with ANSYS - ANSYS Advantage - V13 I1

In 2017, Synopsys® and ANSYS partnered to take the best of ANSYS’ power integrity and reliability offerings and create an integrated flow with Synopsys implementation to drive robust semiconductor design optimization. Following the release of RedHawk Analysis Fusion by Synopsys in 2018, customers have shared positive feedback on productivity and design quality impact that have helped drive further innovations on this platform. We sat down with John Lee, vice president and general manager of the semiconductors division at ANSYS, and Jacob Avidan, senior vice president of signoff products at Synopsys, to get their views on the results of this collaboration and how the ANSYS–Synopsys collaboration helps address the challenges of emerging technologies.

View Article

Brain Trust for Aneurysm Treatment - Article - ANSYS Advantage - V12 I2

To provide effective treatment for brain aneurysms, a pioneering healthcare company has developed a digital twin to help physicians place implant devices during surgery. Incorporating ANSYS structural mechanics solutions, the surgeon can simulate the deployment of the implant and determine its optimal sizing and positioning to decrease the risk of failure and reduce operating times.