Accurate Thermal Analysis Including Thermal Coupling of On-chip Hot Interconnect

Driven by rapid advancement in mobile/server computing and automotive/communications, system on chips (SoCs) are experiencing fast functional integration along with technology scaling. Advanced low-power techniques are widely used while meeting higher performance requirements using a variety of packaging technologies. The Internet of Things (IoT) is further opening up new applications with connected devices and systems, where low power, high performance and reliability are paramount. Since the impact of temperature on power, performance and reliability is huge, accurate thermal analysis is a requirement for the design flow.


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