Skip to Main Content

 

Webinar

Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospects

Thermal issues have hindered the widespread adoption of 3D IC technology. Overcoming these issues has necessitated a concerted effort from all parts of the semiconductor community: architects, circuit designers, electronic design automation (EDA) vendors, foundries and packaging houses. In this presentation, professor Sung Kyu Lim, from Georgia Institute of Technology, discusses thermal issues and challenges for 3D ICs including detailed thermal analysis results of commercial-grade 3D IC designs targeting a wide range of applications. We analyze the root causes of thermal hotspots and their impact on power, performance and area (PPA), and discuss thermal-aware design and EDA solutions used for mitigation. We also address the need for multidisciplinary and multifaceted efforts.

SHARE THIS WEBINAR

Ready to make the impossible possible?

Contact us

* = Required Field

Thank you for reaching out!

We’re here to answer your questions and look forward to speaking with you. A member of our Ansys sales team will contact you shortly.