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2020

Webinar

Hybrid Techniques for the Modeling/Simulation of PCBs

Modeling printed circuit boards (PCB) can be complex and challenging. Board designers and analysts have many questions, including: “Do we need to model every copper feature in the board in detail, or can we use lumped parameter models?”

In this webinar, we will explore Ansys simulation solutions for modeling PCBs and identify which techniques are best-suited for a particular problem. These techniques include detailed trace modeling, trace mapping, reinforcements and lumped material models. Some simulation solutions may require using a hybrid of two or more techniques to get the best results without losing accuracy. We will also discuss how in-development techniques will help revolutionize PCB modeling.

 

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