Ansys HFSS 3D Layout
Learn how the Ansys HFSS 3D layout feature simplifies modeling of layered structures such PCB and high-speed components. HFSS 3D Layout is ideal for designers who work in layered geometry or layout of high-speed components, including on-chip embedded passives, IC packages and PCB interconnects. These types of designs can be easily modeled in the HFSS electrical layout environment while, at the same time, simulating for all 3D features, such as trace thickness and etching as well as bondwires, solder bumps and solder balls. Geometry such as trace width can be easily parameterized and optimized using the integrated Ansys Optimetrics tool in the HFSS 3-D layout interface.