System on chip (SoC) semiconductor ICs consist of a high speed digital core, analog circuits, sensitive radio frequency (RF) modules and I/O interfaces. When these modules are integrated onto the same IC, they share the silicon substrate, and noise injected can propagate from one module to another. The ANSYS Canyon Substrate Extension (CSE) platform can model noise injection from the digital cores, and the propagation of noise through the silicon substrate, including the isolation structures. Typical applications of the ANSYS CSE platform are:

  • Chip image sensors: Noise propagating through the substrate can interfere with the pixel array or analog blocks, causing image grain
  • Automotive IC: Noise propagation from high speed digital cores to sensitive RF circuits can reduce circuit efficiency or cause RF disturbances
  • Sensitive analog circuits: Noise propagation through the substrate can affect the normal operation of sensitive analog circuits