On Demand Webinars
Designing Electric Drivetrains with a Comprehensive Conductive EMI Analysis Solution
Wide bandgap devices have been introduced to electric vehicle (EV) drivetrain for their superiority in loss reduction. However, largely increased switching frequency also introduces major electromagnetic interference (EMI) challenges. Under certain circumstances, motor resolver EMI issues can cause total loss of power on prototype EVs. This webinar highlights Ansys’ differentiated modeling capabilities for designing comprehensive electric drivetrains. It provides a deep dive look at how Ansys tools help virtually design system architectures, evaluate drivetrain performance and assess EMI risks and root causes. This analysis workflow continues to be recognized as a critical puzzle piece for developing next-generation electric drivetrains.View on Demand
Thermal Management for Power Electronics
Ansys Icepak provides thermal management and fluid flow solutions for many types of electronic design applications, including high-power electronics. Icepak is integrated in Ansys Electronics Desktop, enabling comprehensive electronics simulation and design capabilities. This webinar showcases Icepak’s solutions for power electronics.
- Learn thermal management solutions for applications such as IGBTs, planar transformers, bus bars, PCBs, power inverters and wireless power transfer devices.
- Discover multiphysics and electro-thermal-mechanical solutions for high-power electronics.
- Understand reduced order modeling (ROM) and systems modeling for high-power electronics.
- Receive expert insights on PCB reliability solutions.
Design for Reliability Using Ansys Sherlock
Ansys Sherlock automated design analysis software is the only reliability physics/physics of failure (PoF)-based electronics design analysis software that provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages. The process for creating reliability predictions is automated directly from the electrical layout tools. Ansys Sherlock is also used at the component level and system level, from on-die GDS2 layers to full-box design.
Approximately 73% of product development costs are spent on the test-fail-fix-repeat cycle. Sherlock accelerates this process by empowering designers to accurately model silicon–metal layers, semiconductor packaging, printed circuit boards (PCBs) and assemblies to predict solder fatigue failures due to thermal, mechanical and manufacturing conditions. This helps eliminate test failures and design flaws, accelerate product qualification and introduce groundbreaking technologies.
This webinar delivers an insightful overview of Ansys Sherlock and provides a live demonstration.
- Learn how Sherlock provides fast and accurate life predictions for electronic hardware at the component, board and system levels in early design stages.
- Understand how Sherlock helps predict solder fatigue failures due to thermal, mechanical and manufacturing conditions.
- Discover how Sherlock is used at the component level and system level, from on-die GDS2 layers to full-box design.
Modeling Coupling Between Cables and Platforms for Electromagnetic Compatibility with Ansys EMA3D Cable
Automotive systems — and vertical takeoff and landing (VTOL) aircraft — have become complex electrical and RF devices. Fully electric powertrains and autonomous vehicle technologies increase the need for active electrical components, complex interconnected systems and the use of RF systems.
These systems are instrumental for vehicle control and must be analyzed at a higher safety standard. However, the large, fast-changing currents in electric drive systems can impact other electronics or RF systems on the platform, creating complex and challenging requirements. Both far- and near-field sensors require low-noise environments to ensure adequate performance. Real-time decision making for safety-critical situations requires high-speed communication and processing. Power quality from both on-board (powertrain) and off-board (utility grid) requires deliberate electromagnetic compatibility (EMC) analysis.
This webinar spotlights existing and emerging challenges facing electrification and cables and provides an overview of the requirements, test and analysis procedures used by EMC teams. It also describes how teams use simulation and analysis to optimize powertrain coupling. Additionally, it spotlights how validated analysis can guide cable routing and how separation rules enable maximum freedom for cable placement while ensuring compatibility.
- Learn the steps to develop safety-compliant vehicle cable harnesses.
- Understand the design challenges surrounding next-generation cars and VTOL systems.
- Discover the requirements, test and analysis procedures used by EMC teams.