IMS 2018

Engineering the Wireless World with ANSYS

Exhibition Date
Hours
Tuesday, June 12
9:30 am to 5:00 pm
Wednesday, June 13
9:30 amto 6:00 pm
Thursday, June 14
9:30 am to 3:00 pm
 

Booth #1025

Designing advanced driver assistance systems (ADAS), Internet of Things (IoT), 5G and other high-performance digital systems are driving extreme integration of radio frequency (RF) and wireless communications. ANSYS delivers the simulation features you need to create reliable, optimized wireless communications, autonomous systems and components — faster than your competition.

Visit ANSYS in Booth 1025 to experience the industry-leading design flow for antenna synthesis, antenna placement and radio frequency interference (RFI) diagnosis. Discover how the ANSYS 3D layout with 3D-encrypted components can revolutionize your design and business processes by enabling you to share data with intellectual property (IP) protection and assemble large 3D models to predict system time and frequency domain performance. Learn how to combine ANSYS HFSS with thermal and mechanical analyses to create a true multiphysics platform to design mission-critical electronics systems.

ANSYS is the global leader in engineering simulation. We bring clarity and insight to our customers’ most complex design challenges through the broadest portfolio of fast, accurate and reliable simulation tools. Our technology enables organizations in all industries to imagine high-quality, innovative and sustainable product designs that will have an accelerated time to market. Founded in 1970, ANSYS employs almost 3000 professionals, more than 700 of them with Ph.D.s in engineering fields such as finite element analysis (FEA), computational fluid dynamics (CFD), electronics and electromagnetics (EM), embedded software, system simulation and design optimization. Headquartered south of Pittsburgh (USA), ANSYS has more than 75 strategic sales and development locations throughout the world with a network of channel partners in 40-plus countries. Visit www.ansys.com for more information.

In-Booth Presentations

Charlotte Blair, Ph.D.

Charlotte Blair, Ph.D.

Lead Application Engineer
ANSYS Inc.

ANSYS Electrothermal Analysis with National Instruments (NI)/AWR Microwave Office

Tuesday, June 12 — 11 a.m.

Benjamin Kahtan

Benjamin Kahtan

Design Team
Mini-Circuits’ LTCC.

A Multiphysics Design Flow Approach for Mini-Circuits’ LTCC Components

Tuesday, June 12 — 4 p.m.

Isabella Bedford

Isabella Bedford

RF Engineer
Modelithics, Inc.

Solving RF and Microwave Design Integration Challenges Using 3D Component Modeling

Wednesday, June 13 — 11 a.m

Shawn Carpenter

Shawn Carpenter

Senior Product Manager
ANSYS Inc.

Watching the Virtual Road — Modeling Synthetic Automotive Radar Returns with ANSYS HFSS SBR+

Wednesday, June 13 — 4 p.m.

 

Demos

Be sure to get a demonstration of these new capabilities at our two in-booth workstations:

Antenna and Radar

Workstation 1 – Antenna and Radar

ANSYS HFSS streamlines synthesis, setup and analysis of antenna designs. This synthesis feature enables every engineer, including those without antenna expertise, to create and optimize antenna designs and integration. Analyze installed antenna performance with ANSYS HFSS SBR+, a powerful, shooting and bouncing ray (SBR) electromagnetic field solver option for HFSS, which predicts performance of antennae mounted to electrically large platforms. Antenna designs created in HFSS can be linked to the HFSS SBR+ solver and placed on an electrically large platform and rapidly solved. This powerful combination enables you to analyze installed performance and optimize antenna placement.

With a rapidly increasing number of wireless devices and a finite spectrum in which to operate, the likelihood of these communication systems interfering with each other and degrading the performance of neighboring systems becomes greater every day. The ANSYS RF Option now includes EMIT, the industry leading software for predicting RF co-site and electromagnetic interference (EMI) interference of multiple radio transmitters and receivers.

 

Workstation 2 – RF and Microwave Components

Workstation 2 – RF and Microwave Components

As communication systems push the limits of component size, weight and performance, engineers must adopt new technologies and smarter workflows. Whether the component is a structure used in a radio frequency integrated circuit (RFIC)/monolithic microwave integrated (MMIC), module, surface mount device for printed circuit board (PCB) design or a complete system, sharing high-fidelity model information that accounts for the EM field interactions (i.e., coupling) between integrated components and the system platform allows design teams to adopt new technologies quickly and safely. The new 3D EM component in HFSS is a breakthrough in model sharing, allowing engineers to create encrypted, password-protected user-models that provide all the information to design RF and microwave components into high-frequency networks.

ANSYS is the only provider that offers a design flow spanning electrical, thermal and mechanical analyses. Mechanical reliability and thermal integrity are critical design considerations for RF components, packages and PCBs that affect reliability and product lifecycle. The ANSYS design flow enables you to determine the thermal impact and evaluate stress, shock and vibration effects on surface mount devices, connectors, MMICs/RFICs, antennae and more.

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