Electronica 2016

ANSYS at Electronica 2016: simulating complex, innovative electronics with confidence

With the rapid emergence of the Internet of Things (IoT), there are more smart devices connected to the internet today than there are human beings in the world. The demand for these innovative products is creating massive opportunities for existing businesses and giving rise to brand new markets and companies. The potential economic impact has been estimated to be more than $10 trillion per year.

To help drive the exponential growth of the IoT, ANSYS has developed the industry’s most comprehensive simulation solutions that improve the performance and reliability of electronic products.  Industry data indicates that Simulation-Driven Product Development is a critical success factor in designing the devices of tomorrow, whether they are consumer electronics, medical implants, connected cars or industrial equipment.

Come visit us at Booth Hall A1, Stand 642 to learn how you can apply ANSYS solutions in your applications, including:

Chip-Package-System Design

Chip-Package-System Design
Designing high-speed printed circuit boards (PCBs) and semiconductor integrated circuits (ICs) for the Industrial Internet of Things (IIoT) poses significant challenges due to design complexity in the form of lower operating voltages, increased circuit density and faster data rates. The chip-package-system (CPS) workflow from ANSYS enables PCB designers to simulate their designs, including crucial information from IC and package models, while IC designers can include the impact of package and PCB when verifying their IC designs. Newly automated thermal analysis and integrated structural analysis capabilities enable you to deliver smaller, lower power, and higher performance products.

 

Antenna Design and Wireless Communication

Antenna Design and Wireless Communication
The performance of wireless systems can be very different in the real world, compared to the prototype testing environment of an anechoic chamber. Multipath signal propagation and fading are caused by complex real-world structures, mobility and even human beings. Additionally, modern devices with multiple wireless technologies and frequency bands require multiple antennas, which degrade performance through antenna coupling and co-site issues. Learn how engineers are using ANSYS solutions to perform finite element domain decomposition, 3-D method of moment, hybrid, and shooting and bouncing ray (SBR) techniques to quickly solve electrically large and complex full-wave electromagnetic models.

 

Power Electronics Design

Power Electronics Design
Industries such as automotive, aerospace and industrial automation are steadily increasing the amount of power electronics in mechatronic applications to deliver smarter,reliable and more efficient products. Important issues to consider for design and management of these systems include semiconductor power loss and thermal performance during cycling, surge currents and voltages during switching, and conducted and radiated emissions (EMI/EMC) due to increasingly higher switching frequencies. ANSYS simulation software supports device and component characterization tools.

 

Embedded Software Development

Embedded Software Development
The modern car may contain 50 million to 100 million lines of code. With autonomous vehicles on the way, we can expect software content to rapidly increase. But embedded software is not just for cars: It is essential to many IoT devices, including industrial equipment, robotics, planes and drones. ANSYS’ embedded software development and simulation environment, with a built-in automatic code generator, significantly accelerates the pace of embedded software development projects. ANSYS solutions enable you to model complex systems, understand the interaction of various subsystems, and generate high-integrity code that complies with many industry standards.

ANSYS Presentations at Conference Forums

Embedded Forum
Tuesday, November 8, 14:00 – 14:30
Predictive Analytics, Simulation and the Digital Twin

PCB & Components Marketplace Forum
Tuesday, November 8, 16:30 – 17:00
Efficient design flow for electromagnetic and thermal simulation of PCBs

Electronica Automotive Forum
Thursday, November 10, 14:30 – 15:00
Electromagnetic Simulation of EMC effects in automotive applications

Fabrice Pena

Fabrice Pena, Senior Vice President
ANSYS, Inc.

Atte Focho

Atte Focho, Senior Technical Engineer
ANSYS, Inc.

Markus Laudien

Markus Laudien, Lead Technical Engineer
ANSYS, Inc.

 

 

We're pleased to offer a few complementary tickets. To be eligible, please send an email to Workshops-germany@ansys.com.

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