ANSYS Innovation Conference - Expo Tel Aviv

June 20th, 2019

The annual ANSYS INNOVATION USERS CONFERENCE held in Tel Aviv on June, 20. This is an excellent opportunity to learn about the latest technologies in simulation and connect with your peers.

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Keynote Speakers

We are delighted to announce our keynotes speakers

Rick Mahoney 

Rick Mahoney

ANSYS Senior Vice President of Worldwide Sales

Alexander DUESENER

Alexander Duesener

ANSYS EMEA
Vice President

John Lee

John Lee

ANSYS Vice President and GM
Semiconductor BU

This session will allow you to:

Learn about trade tips, tricks and successes relating to ANSYS simulations in all
platforms from electronics and semiconductor to mechanical and fluid designs

Gain insight into best practices and see demonstrations

Network with your fellow IT professionals


AGENDA

9:00 Welcome & Registration
9:30 Introduction,  Shay Goldlust, ANSYS Country Manager- Israel
9:45 KEYNOTE -  Rick Mahoney , ANSYS Senior Vice President of Worldwide Sales & Alexander Duessner, ANSYS EMEA Vice President
10:40 Coffee Break
 
Semiconductor
Signal & Power Integrity
Electromagnetics
Mechanical
Fluids
11:00 Room M Room L Room I Room K
  Semiconductor Vision
ANSYS - John Lee
Vice President and GM
Semiconductor BU
ANSYS Electronics & Systems - High Level Strategy and Roadmap  
ANSYS - Devin Crawford Business Development Director (EMEA)
ANSYS Electronics & Systems - High Level Strategy and Roadmap  
ANSYS - Devin CrawfordBusiness Development Director (EMEA)
ANSYS Mechanical High Level Strategy and Roadmap
ANSYS- Alex PettRegional Product Manager
Fluids Keynote
ANSYS - Tomasz StelmachSenior Application Engineer
11:30 Room M Room L Room I Room K
  Semiconductor Tools Updates and Technology Readiness
ANSYS - Ehud Tamar Application Engineer Manager
Simulation for Development of Highly Automated Vehicles
ANSYS - Devin Crawford
Business Development Director (EMEA)
Simulation for Development of Highly Automated Vehicles
ANSYS - Devin Crawford
Business Development Director (EMEA)
Spaceclaim Advanced Hexa Mesh Creation
ANSYS - Tom David Application Engineer
Fluent Adjoint Optimization
ANSYS - Sabrina Hafid
Application Engineer
12:00 Room M Room L Room I Room K
  RHSC- Different Analysis Approaches
ANSYS - Vladimir Berlin
Application Engineer
Whats New in "2019 R2" HFSS
ANSYS- Hen Leibovich
Technical Support Engineer
Whats New in "2019 R2" HFSS
ANSYS - Hen Leibovich
Technical Support Engineer
ANSYS Motion - A New Paradigm in Multibody Dynamics
ANSYS- Alex Pett
Regional Product Manager
New Parallelized Fluent Meshing Watertight Workflow for Fast and Accurate CFD Simulations
TENZOR - Tomer Avraham
CFD & Thermal Specialist
12:30 Room M Room L Room I Room K
  Fast and Accurate Incremental Power and Signal Integrity Analysis
Mellanox Technologies-
Anton Rozen - Director of VLSI Backend Department &Rotem Cohen - VLSI Backend Engineer
SI & PI Tools Updates and Technology Readiness "2019 R2"
ANSYS - Shai Sayfan Altman
Senior Application Engineer
SI & PI Tools Updates and Technology Readiness "2019 R2"
ANSYS - Shai Sayfan Altman
Senior Application Engineer
Enabling Solution of Large Deformations Through Nonlinear Adaptive Meshing
ANSYS- Alex Pett
Regional Product Manager
Reduced Order Models - ROMBuilder and Dynamic DynaROM
ANSYS - Tomasz Stelmach
Senior Application Engineer
13:00 Lunch
14:00 Room M Room L Room I Room K
  SoC Level Electromagnetic Crosstalk Analysis and Signoff
ANSYS- Kostas Nikellis
Director, R&D
SoC Level Electromagnetic Crosstalk Analysis and Signoff
ANSYS- Kostas Nikellis
Director, R&D
Detection and Imaging of Ultrafast Targets with 79GHz RADAR
Maisense - Dr. Moshik Cohen
CEO
Efficient Assessment of Fluid-Structure Interaction methodology
TENZOR- Tomer Avraham
CFD & Thermal Specialist
Driving Innovation in Bio-Engineering
TENZOR -Maciej Ginalski
Application Engineer Manager
14:30 Room M Room L Room I Room K
  Joint PI System Simulation Between Silicon and Package
ANSYS - Shai Sayfan Altman & Vladimir Berlin
Application Engineers
Joint PI System Simulation Between Silicon and Package
ANSYS - Shai Sayfan Altman & Vladimir Berlin
Application Engineers
RX  Sensitivity Reduction Analysis  Due to External Interference Sources Using HFSS and EMIT
Electromagnetics Infinity - Vladimir Vulfin
CEO
Structural & Acoustic Assessment of Electric Machines
ANSYS- Alex Pett
Regional Product Manager
Rapid Powder Discharge from a Small Vessel
Rafael - Noam Leshem
15:00 Room M Room K Room L Room I
   Electronic Realiability through Mechanical Analysis
ANSYS - Tom David
Application Engineer
SI/PI Automation
ANSYS - Devin Crawford
Business Development Director (EMEA)
RF and Thermal Analysis for Antenna Array using ANSYS Electronics Desktop
ANSYS - Hen Leibovich
Technical Support Engineer
Automation of Simulation Workflow for PCB Thermal Analysis
ELBIT - Jackie Kettner
Senior Thermal Engineer
Automation of Simulation Workflow for PCB Thermal Analysis
ELBIT - Jackie Kettner
Senior Thermal Engineer
15:30 Room M Room K Room L Room I
  Designing Power-Efficient & Safe Autonomous Driving Devices: Using Custom Techniques to Identify/Fix Hotspots at RTL
Mobileye - Erez Iluz
SOC Power Modeling Engineer
EMI SImulation using SIwave
ANSYS - Shai Sayfan Altman
Senior Application Engineer
Design of Embedded Antennas in IoT Devices for WiFi, BT, Cellular and LoRa
Electromagnetics Infinity - Vladimir Vulfin
CEO
Discovery Products Demo
ANSYS - Tom David
Application Engineer
Discovery Products Demo
ANSYS - Tom David
Application Engineer
16:00 Closure & Lottery

 

Tel Aviv

Expo Tel Aviv
Rokach Blvd 101
Tel Aviv 6121002

CONTACT

ANSYS Israel
info-israel@ansys.com
+972-3-9470692

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