This dynamic webinar series showcases the past, present and future of mobile networking, and how the convergence of 5G, edge computing and artificial intelligence machine learning will change the industry landscape. Additionally, it illustrates the 3D Component Domain Decomposition Method workflow for the analysis of phased array antennas and also demonstrates handheld antennas.


Upcoming Webinars:


Modeling and Simulation of 5G Antenna System Innovations

March 23, 2021
2 PM CET / 11 AM EDT / 3 PM GMT / 8:30 PM IST

Speaker: Hawal Rashid, Lead Application Engineer, Ansys

Ansys has developed a breakthrough technology, known as 3D Component Domain Decomposition Method (3D Comp DDM), that enables the accurate and efficient simulation of antenna arrays. Whether solving complex, electrically large antenna arrays, or relatively simple antenna arrays, this technology enables fast simulation without compromising on accuracy. 3D Comp DDM enhances the simulation process offering a robust and scalable solution for modeling realistic arrays while capturing finite array truncation effects.

In this presentation, a workflow for the analysis of 5G phased array antennas and hand-held antennas will be demonstrated.

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On-Demand Webinars:


Ensure 5G Systems Integrity by Using Multiphysics Analysis of Chips, Packages and Systems

Speaker: Wade Smith, Manager Application Engineering, Ansys

The evolution of 5G systems is rooted in the consistently increasing need for more data. Whether the application is future medical systems, autonomous vehicles, smart cities, AR/VR, IoT, or standard mobile communications systems, all require an ever-increasing amount of data. For 5G systems to reliably work, the physical data pathways must be well understood and reliably designed. Whether the pathway is in the chip or the wireless channel, large amounts of data must seamlessly flow unimpeded. This presentation will discuss the various data paths in 5G systems and how Multiphysics analysis can help design these paths to allow for maximum data integrity.

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Systematic Cybersecurity Threat Analysis and Risk Assessment

Speaker: Mario Winkler, Lead Product Manager, Ansys

The digital revolution has produced vehicles with unprecedented connectivity, which makes them vulnerable to cyberattack. Ansys medini for Cybersecurity helps secure in-vehicle systems and substantially improves time to market for critical security-related functions. It addresses the increasing market needs for systematic analysis and assessment of security threats to cyber-physical systems, starting early in the system design phase.

In this webinar, we demonstrate how systematic cybersecurity analysis mitigates vulnerability to hacking and cyberattacks.

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Modeling and Simulation of 5G Antenna System Innovations

Speaker: Hawal Rashid, Lead Application Engineer, Ansys

Ansys has developed a breakthrough technology, known as 3D Component Domain Decomposition Method (3D Comp DDM), that enables the accurate and efficient simulation of antenna arrays. Whether solving complex, electrically large antenna arrays, or relatively simple antenna arrays, this technology enables fast simulation without compromising on accuracy. 3D Comp DDM enhances the simulation process offering a robust and scalable solution for modeling realistic arrays while capturing finite array truncation effects.

In this presentation, a workflow for the analysis of 5G phased array antennas and hand-held antennas will be demonstrated.

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5G Design Innovation through Simulation

Speaker: Shawn Carpenter, Program Director, Ansys

With the progression of wireless communication networks from 4G to 5G, mobile networking is unlocking enormous benefits for businesses and consumers alike. Applications and business opportunities will soon become available that were previously beyond imagination. As the road to 5G and beyond presents significant challenges for technology providers, those who can offer timely solutions with the highest reliability stand to gain tremendous benefit and increase market share.

This presentation showcases the past, present and future of mobile networking, and how the convergence of 5G, edge computing and artificial intelligence machine learning will change the industry landscape. Modeling and simulation will drive this revolution—particularly in combining the physics of electromagnetics, optical, thermal, mechanical, and materials. Additionally, digital twins for modeling wireless devices within virtualized, realistic, city-sized environments will reduce the need for costly prototypes and exploratory testing in physical installations.

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5G and the Connected Vehicle

Presenter: Markus Laudien

Establishing a connected vehicle infrastructure requires 5G technology and a stable link across a variety of communication channels. Simulating these scenarios allows engineers to predict reliability and requires advanced asymptotic solvers for managing key geometry size versus wavelength tradeoffs and the handling the model geometry complexity. In this webinar, the advanced shooting and bouncing Ray (SBR+) method within Ansys HFSS will be presented as solution. We will address the placement of antennas, setup of moving trajectories and how to import models — including vehicles, areas of a street or parts of a city — to support your simulation. Additionally, critical post-processing capabilities and recommended solver settings will be discussed.

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Placing Antennas with Ansys HFSS SBR+ Simulation

Presenter: Markus Laudien

Application areas like 5G and radar systems often require the simulation of antenna placement on large vehicles and buildings. This is usually a challenging task due to the geometry size versus wavelength tradeoffs and the complexity of the model geometry. Asymptotic solvers are known to be a solution for these applications. In this webinar, the highly accurate shooting and bouncing ray (SBR+) method within Ansys HFSS will be presented as an advanced solution. A live demonstration will spotlight how it can be combined in a hybrid simulation approach with finite-element boundary integral (FEBI) domains or reading in far-field or near-field sources. Additionally, key post-processing capabilities and recommended solver settings will be discussed.

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5G Design Innovation Through Simulation

Presenter: Shawn Carpenter

With the progression of wireless communication networks from 4G to 5G, mobile networking is unlocking enormous benefits for businesses and consumers alike. Applications and business opportunities will soon become available that were previously beyond imagination. As the road to 5G and beyond presents significant challenges for technology providers, those who can offer timely solutions with the highest reliability stand to gain tremendous benefit and increase market share.

This presentation showcases the past, present and future of mobile networking, and how the convergence of 5G, edge computing and artificial intelligence machine learning will change the industry landscape. Modeling and simulation will drive this revolution—particularly in combining the physics of electromagnetics, optical, thermal, mechanical, and materials. Additionally, digital twins for modeling wireless devices within virtualized, realistic, city-sized environments will reduce the need for costly prototypes and exploratory testing in physical installations.

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Simulating Human Exposure to 5G Radiation

Most 5G applications directly concern user equipment with wireless devices in close proximity to human beings, so assessment of human exposure is a crucial aspect for device manufacturers. Furthermore, a much higher density of infrastructures will force 5G base-stations to be closer to people than is common with current cellular infrastructure.

In this webinar, we provide an overview of the main challenges related to human exposure assessment to 5G electromagnetic fields, highlighting the growing importance of numerical approaches and their benefits compared to measurement. In particular, the capabilities of state-of-the-art simulation solvers will be demonstrated by showing examples of SAR and power density evaluation on realistic test cases.

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3D Component Arrays Demonstration

The design of large antenna arrays is a challenging task for application areas like 5G and radar systems. Due to the complexity and the large number of excitations a simulation of the whole array —including couplings and edge effects — requires advanced solver techniques. In this webinar, the numerical technique of the domain decomposition based on 3D components within Ansys HFSS will be showcased with key examples. This approach allows the usage of non-identical array cells — operating at different frequencies — and highly parallelized solutions across multiple cores. A live demo will spotlight the setup procedure and post-processing capabilities will be presented, illustrating how you can define individual excitation for every individual cell as a post-processing operation.

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Exploring Ansys HFSS 3D Layout-Driven Assembly

Learn how to combine ECAD layout designs together, add mechanical CAD connectors or 3D component models in Ansys HFSS 3D Layout to accurately extract complex interconnect systems with 3D electromagnetic field simulation. This allows leading companies to break through the established silos of separate IC, package and board design and gain insight to the integrated IC-package-board design.

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Optimizing Speed with HFSS Regions in SIwave

Learn how the speed and accuracy of Ansys SIwave can be improved by leveraging HFSS Regions in SIwave, a cutting-edge technique for supporting high-speed printed circuit board (PCB) channel design requirements. This presentation compares the technique versus solely using Ansys HFSS, and explains how you can balance tradeoffs between accuracy, simulation speed, ease of use, and employing high-performance computing (HPC) options to solve 3D regions in parallel. Additionally, this webinar spotlights Ansys’ future plans for improving HFSS Regions in SIwave.

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Introduction to Ansys HFSS 3D Layout

Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components. HFSS 3D Layout is ideal for designers who work with layered geometry or layout high-speed components, including on-chip embedded passives, IC packages and PCB interconnects. These types of designs can be easily modeled in the HFSS electrical layout environment and simultaneously simulate all 3D features, such as trace thickness, etching, bondwires, vias, solder bumps and solder balls. Geometry such as trace width can be easily parameterized and optimized using the integrated Ansys Optimetrics tool within the HFSS 3D Layout interface.

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Featured Content:


Ansys 5G Mobile/UE Solutions

Ansys simulation software for 5G provides a compelling set of design solutions from mobile user equipment to networks and beyond. Simulation applications include electronics thermal management, advanced RF front-end design, and radio desensitization and EMI issues in 5G Smartphones. Download this white paper to learn more.

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5 G Mobile Solutions

Ansys 5G Antenna Solutions

Designing 5G wireless systems is a huge undertaking. Antenna beamforming and beamsteering in 5G are key to improve the capacity and data rates for wireless applications. Massive MIMO, for instance, requires phased array antennas to be designed carefully to optimize the gain and ensure targeted coverage. Ansys tools are ideal for designing and simulating antennas, antenna-to-antenna coupling and environmental effects on signal propagation. Ansys solutions can enable successful deployment of V2X and V2V systems to improve the safety of self-driving cars that are expected to hit the road in 5G. Read this white paper to learn more.

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5G Antenna Solutions

Multiphysics Simulations for RFICs and SoCs for 5G Applications

Ansys multiphysics simulations simultaneously solve power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first-time silicon and system success.

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5G Multiphysics Simulations

Engineering What’s Ahead: 5G INTELLIGENT CONNECTIVITY

Find out how pioneers like Qualcomm and AMD are using simulation to address these critical market needs by downloading the e-book.

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5G INTELLIGENT CONNECTIVITY