Multiphysics Simulations for AI Silicon to System Success

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Achieving power efficiency, power integrity, signal integrity, thermal integrity and reliability is paramount for enabling product success by overcoming the challenges of size and complexity in AI hardware and optimizing the same for rapidly evolving AI software. ANSYS’ comprehensive chip, package and system solutions empower AI hardware designers by breaking down design margins and siloed design methodologies with multiphysics simulations and multi variable analytics to exceed PPA and reliability goals. ANSYS brings together the power of big data analytics, elastic compute scalability and multiphysics simulations to simultaneously address power, thermal, variability, timing, electromagnetics and reliability challenges across the spectrum of chip, package and system to promote first time silicon to system success.

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본인은 Ansys 및 파트너로부터의 최신 정보 및 관련 정보 수신을 희망합니다. 본인은 언제든지 수신을 거부할 수 있습니다. Ansys 개인정보처리방침

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