Reliability of Microvias/Plated Through-Holes in PCB

Due to the higher I/O density and smaller electronic packages, the demand for high-density interconnects (HDIs) has increased significantly. Microvias are essential elements in HDI printed circuit boards (PCBs). Failure of these structures is the most common cause of open circuits in PCBs. This has created great concern for the reliability of microvias within the electronics industry.

This webinar briefly discusses common failure mechanisms in microvias and plated through-holes, and highlights their differences. It also identifies common manufacturing defects and how they influence the reliability of these structures.

The presentation addresses the challenges and pitfalls associated with the modeling of these devices using the finite element method (FEM), as well as the importance of statistical analysis on fatigue life prediction of plated through-holes (PTHs).

Finally, the webinar provides a new, fully automated approach to analyze complex PCB designs and identify the configurations that are susceptible to failure.

본인은 Ansys 및 파트너로부터의 최신 정보 및 관련 정보 수신을 희망합니다. 본인은 언제든지 수신을 거부할 수 있습니다. Ansys 개인정보처리방침