The Reliability of BGAs, QFNs and Other Critical Packages

There are many factors that determine the thermal cycling robustness of an electronic package. Packages that have known thermal cycling issues include ball grid arrays (BGAs), quad flat no-leads (QFNs) and ceramics. This presentation discusses the critical parameters of these packages that may affect the thermal cycling performance. The webinar also covers other possible reasons why your electronic product may not be robust with regards to thermal cycling.

본인은 Ansys 및 파트너로부터의 최신 정보 및 관련 정보 수신을 희망합니다. 본인은 언제든지 수신을 거부할 수 있습니다. Ansys 개인정보처리방침