Multiphysics Reliability Signoff for Next-Generation Automotive Electronics Systems - TSMC

webinar-thumbnail

Design for reliability is a key consideration for the successful use of next-generation systems-on-chip (SoCs) in ADAS, infotainment and other critical automotive electronics systems. The SoCs manufactured with TSMC’s 16FFC process are advanced multicore designs with significantly higher levels of integration, functionality and operating speed. These SoCs must meet the rigorous requirements for automotive electronics functional safety and reliability.

Working together, ANSYS and TSMC have defined workflows that enable electromigration, thermal and ESD verification and signoff across the design chain (IP to SoC to package to system). Within the comprehensive workflows, multiphysics simulations capture the various failure mechanisms and provide signoff confidence not only to guarantee first-time product success, but also to ensure regulatory compliance.

Attend this ANSYS and TSMC webinar to learn about ANSYS’ chip-package-system reliability signoff solutions for creating robust and reliable electronics systems for next-generation automotive applications, and to explore case studies based on TSMC’s N16FFC technology.

Share:

본인은 Ansys 및 파트너로부터의 최신 정보 및 관련 정보 수신을 희망합니다. 본인은 언제든지 수신을 거부할 수 있습니다. Ansys 개인정보처리방침

ANSYS에 문의하십시오.

문의하기