Multiphysics Optimization of Electronics Systems Using ANSYS Icepak, ANSYS Mechanical and ANSYS optiSLang

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Electronics systems are becoming more and more compact and require sophisticated optimization techniques to achieve optimal performance. The growing complexity of the design space makes it very difficult for engineers to identify the key variables that need to be optimized. A multiphysics solution is needed.

View this on-demand webinar to learn about a leading-edge optimization procedure applied to the thermomechanical setup of an electronics system. The procedure involves multiphysics thermomechanical analyses using ANSYS Icepak and ANSYS Mechanical, followed by system optimization using ANSYS optiSLang within the ANSYS Workbench framework. Using this process, you can optimize your design for minimal heat sink mass, fan flow rate and thermal stress while constraining the temperature within a given limit.

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본인은 Ansys 및 파트너로부터의 최신 정보 및 관련 정보 수신을 희망합니다. 본인은 언제든지 수신을 거부할 수 있습니다. Ansys 개인정보처리방침

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