Achieving Electronics System Reliability for 5G Designs

5G network infrastructure will rely on high-frequency mmWave spectrum, massive multiple- input-multiple-output (MIMO), small cells and beamforming and beam tracking capabilities. These will increasingly complicate the design of 5G systems that must now absorb huge amounts of antenna data, support a variety of 5G air interfaces — massive machine type communication (MTC), enhanced mobile broadband (eMBB) and ultra-reliable and low latency communication (URLLC) — and offer significantly higher processing capabilities within a power- and thermal-constrained environment.

In this presentation, Dr. Norman Chang, chief technologist for ANSYS/semiconductors, addresses reliability challenges, including electromigration (EM), thermal-aware EM, thermal-induced mechanical stress, electrostatic discharge (ESD) and device aging: All are key for 5G electronics systems design to enable mission-critical applications of the future, e.g., self-driving cars.

본인은 ANSYS 및 파트너로부터의 최신 정보 및 관련 정보 수신을 희망합니다. 본인은 언제든지 수신을 거부할 수 있습니다. ANSYS 개인정보처리방침