Ansys VeloceRF is an inductive device compiler and modeling tool that solves some of your most complex challenges for as low as 5nm geometries.
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ANSYS empowers customers beyond signoff by breaking down margin barriers with multiphysics simulations, big data analytics and chip-package-system (CPS) co-analyses to exceed power, performance, area and reliability goals. Read this application brief to learn how ANSYS simulation solutions can help you with margin management, actionable analytics, CPS multiphysics challenges, voltage-variation aware timing analysis and first-time silicon success.
ANSYS Exalto is a powerful post-LVS RLCk extraction software for IC design engineers. It enables accurate prediction of electromagnetic coupling effects during the signoff phase.
ANSYS RaptorX is a novel, pre-LVS EM modeling software for the electromagnetic expert and the IC design engineer. The limitless capacity of its engine, in combination with highly accurate results and blazing fast modeling times, differentiates it from currently available, traditional EM tools.
Ansys medini analyze helps semiconductor manufacturers in the automotive domain with dedicated ISO 26262 support.
This infographic presents the challenges associated with optimizing combustion and reacting flows and the benefits of using ANSYS fluids simulation versus conventional solutions.
5G network infrastructure will rely on high-frequency mmWave spectrum, massive multiple- input-multiple-output (MIMO), small cells and beamforming and beam tracking capabilities. These will increasingly complicate the design of 5G systems that must now absorb huge amounts of antenna data, support a variety of 5G air interfaces — massive machine type communication (MTC), enhanced mobile broadband (eMBB) and ultra-reliable and low latency communication (URLLC) — and offer significantly higher processing capabilities within a power- and thermal-constrained environment.
In this presentation, Dr. Norman Chang, chief technologist for ANSYS/semiconductors, addresses reliability challenges, including electromigration (EM), thermal-aware EM, thermal-induced mechanical stress, electrostatic discharge (ESD) and device aging: All are key for 5G electronics systems design to enable mission-critical applications of the future, e.g., self-driving cars.