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Electronics Reliability

Solve your biggest thermal, electrical and mechanical reliability challenges.


Optimize and Predict Electronics Reliability

Best practices for ensuring and predicting electronics reliability require comprehensive multi-physics simulations. Ansys ensures reliability success by developing solutions and workflows that overcome today’s biggest simulation and design challenges.

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    Extract Detailed Geometries from any ECAD file
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    Perform Complex Multiphysics Analyses
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    Predict Time to Failure Before Prototyping
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    Implement Automation and Optimization

Electronics Reliability Just Got Easier

Sherlock Thermal Analysis

Design Democratization

Ansys Electronics Reliability solutions allow organizations to capture a wide-range of parts, materials, simulation and other data, as well as access to critical, simulation-ready material and component data.

Robust Reliability Predictions

Reliability predictions based on physics of failure (PoF) principles resides at the core of the Ansys Electronics Reliability portfolio. Using Ansys simulation tools, electronics manufacturers can determine how long it takes for a product to fail and why the failure occurred.

Workflow Automation

Ansys Electronics Reliability tools allow engineers to create comprehensive simulation workflows that include high-levels of automation.

Electrical, Thermal and Mechanical Analysis

Integrated workflows between Ansys Sherlock, Icepak, Mechanical, LS-DYNA, and more provide the simulation results necessary to optimize product designs and ensure reliability in the field.

Featured Products

Determine the electronics reliability workflow that works for you and your team

Simulation isn’t a one size fits all. That’s why Ansys provides multiple electronics reliability workflows to fit your product and your reliability needs.


Solve Thermal, Mechanical and Electrical PCB Challenges

Analyze the electrical, thermal and mechanical characteristics of a PCB— all using Ansys tools.


Determine the Components Most at Risk During Temperature Cycling

Identify the most temperature-sensitive components in power supply design and learn how to make physics-based decisions on how hot is too hot.


Improve Automotive Electronics Reliability

This white paper details the use of Physics of Failure modeling to ensure automotive electronics reliability.

Printed Circuit Board (PCB) Solutions

Ansys solutions for PCB reliability include a multi-physics workflow that uses a suite of leading simulation tools.  Using our workflow solutions, you can simulate electrical, thermal, and mechanical effects to determine product reliability.

  • Ansys HFSS and SIwave to determine Power and Signal Integrity
  • Ansys Icepak to assess Thermal Integrity
  • Ansys Mechanical for Structural Analysis
  • Ansys LS-DYNA for Drop-Test and Impact Studies
  • Ansys Sherlock for Reliability (Life) Predictions of Electronics Systems

Featured Events


PCBs Ansys Icepak
Reliability Analysis of PCBs with Ansys Icepak, HFSS 3D Layout, Mechanical, and Sherlock

In this webinar, learn how Ansys SIwave, Ansys Icepak, Ansys Mechanical and Ansys Sherlock can be used as a comprehensive multi-physics solution to optimize PCB reliability.

Ansys Icepak Ansys Sherlock Temperature Cycling
Ansys Icepak and Ansys Sherlock for Temperature Cycling

This webinar will demonstrate an automated process of thermal modeling of printed circuit boards. It will present a workflow to translate ECAD data to a thermal and mechanical model in Ansys Icepak, followed by the transfer of results into Ansys Sherlock for solder fatigue analysis.

Webinar On Demand
Ansys Electronics Reliability
Ansys 2021 R2: Ansys Sherlock and Electronics Reliability Update

This webinar covers product integrations, relevant updates for each tool that will enable faster and more efficient simulations and updates to key workflows that help users address important electronics reliability challenges.

Featured Resources




Continental Automotive Tests its Product Reliability in a Fraction of Time Before Building Prototype

Continental Automotive chose Ansys Sherlock for its ability to quantify the changes in reliability of a component due to various system-level effects, including the thermomechanical influence of these adhesives


Short Article Title One Line

It is a long established fact that a reader will be distracted by the readable content of a page when looking at its layout.


Short Article Title One Line

It is a long established fact that a reader will be distracted by the readable content of a page when looking at its layout.


Short Article Title One Line

It is a long established fact that a reader will be distracted by the readable content of a page when looking at its layout.


White Paper

Reliability Physics Analysis for Implementing SAE J3168 Standard

This white paper describes the approach and content of SAE J3168 and the challenges in implementing it in AADHP applications. It further describes the use of Ansys Sherlock software to implement SAE J3168.



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